Memory chip maker uses Keysight’s integrated PCIe test solutions to validate Compute Express Link (CXL) technology.
Packaging
Chinese Companies Hold Only 4% of Global IC Marketshare
U.S. companies captured 54% of the total worldwide IC market in 2021, propelled by a 47% share of IDM sales and a 68% share of fabless sales.
New Polymer Materials Make Fabricating Optical Interconnects Easier
New technology poised to make silicon photonics more practical, which could boost efficiency of Internet data centers.
Bechtel Announces New Manufacturing and Technology Business
Bechtel today announced the formation of its new Manufacturing and Technology business.
2021 Global Semiconductor Equipment Sales Surge 44% to Industry Record $102.6 Billion, SEMI Reports
Worldwide sales of semiconductor manufacturing equipment in 2021 surged 44% to an all-time record of $102.6 billion from $71.2 billion in 2020.
Georgia Tech to Help Define Future of Microelectronics Industry
Georgia Institute of Technology has been selected as a key collaborator in producing a roadmap for the future of advanced packaging for next generation microelectronics.
Leading Semiconductor Players to Advance Next Generation FD-SOI Roadmap for Automotive, IoT and Mobile Applications
CEA, Soitec, GlobalFoundries and STMicroelectronics have announced a new collaboration in which they intend to jointly define the industry’s next generation roadmap for FD-SOI (fully depleted silicon-on-insulator) technology.
Murata Named as an Intel 2022 EPIC Distinguished Supplier
Murata announced that it has earned Intel’s Excellence, Partnership, Inclusion and Continuous Improvement (EPIC) Distinguished Supplier Award.
First Integrated Laser on Lithium Niobate Chip
For all the recent advances in integrated lithium niobate photonic circuits — from frequency combs to frequency converters and modulators — one big component has remained frustratingly difficult to integrate: lasers.
SRC Selected by NIST’s Advanced Manufacturing Office to Define the Future of Microelectronics and Advanced Packaging Technology
Semiconductor Research Corporation (SRC) announced today that it has been selected by the U.S. Department of Commerce’s National Institute of Standards and Technology’s (NIST) Advanced Manufacturing Office to define the future technology goals of the microelectronics and advanced packaging technology (MAPT) industry.
