Following the introduction of the America COMPETES Act of 2022 from the House of Representatives, companion legislation to the U.S. Innovation and Competition Act (USICA), which passed the Senate last June, the Information Technology and Innovation Foundation (ITIF), the leading think tank for science and technology policy, released the following statement.
Packaging
CEVA Introduces Security IP for Die-to-Die Communication Between Chiplets
CEVA, Inc. announced today that it has expanded its IP market reach by introducing the Fortrix SecureD2D IP solution.
North American Semiconductor Equipment Industry Posts December 2021 Billings
After record-breaking billings of North America-based semiconductor equipment manufacturers in November 2021, December billings remained robust and were the second-highest ever.
SPIE and the University of Rochester Announce $1 Million Optics Graduate Fellowship
SPIE, the international society for optics and photonics, and the University of Rochester have announced the establishment of the SPIE Graduate Fellowship in Optical Sciences and Engineering.
Top Tier Semiconductor Supplier Qualifies Veeco’s Wet Processing System for Next Generation High Bandwidth Memory Applications
Veeco Instruments Inc. today announced that a world leading semiconductor supplier has qualified Veeco’s WaferStorm Wet Processing System for advanced packaging applications that will support next generation high bandwidth memory (HBM).
SEMI Industry Strategy Symposium Europe to Spotlight Environmental Sustainability, Social Responsibility and Supply Chain Resilience
SEMI announced today the return of the Industry Strategy Symposium Europe (ISS Europe) 2022 as an in-person event to Brussels, Belgium, May 30, with insights from leading analysts, economists, policymakers and technologists on major forces impacting the semiconductor industry.
IC Sales Seen Growing by Double-Digits for Third Year in a Row
First three-year period of double-digit gains in 25 years, based on IC Insights’ forecast.
Amcor Announces Strategic Investment in PragmatIC Semiconductor
In its continuing efforts to discover and develop innovative technologies for the packaging industry, Amcor announced today its strategic investment in PragmatIC Semiconductor.
Intel Announces Next US Site with Landmark Investment in Ohio
Intel will invest more than $20 billion to build two new factories and to establish a new epicenter for advanced chipmaking in the Midwest.
Kandou Secures 2022 Supply Chain Capacity for USB4 Retimer Chips
Kandou today announced it has secured foundry capacity and backend IC packaging and testing services to meet all 2022 customer requirements for its Matterhorn USB-C multiprotocol retimer with USB4 support
