Packaging

Intel and AWS Expand Strategic Collaboration

Intel Corp. and Amazon Web Services. Inc., an Amazon.com company, today announced a co-investment in custom chip designs under a multi-year, multi-billion-dollar framework covering product and wafers from Intel.

Purdue Deep-Learning Innovation Secures Semiconductors Against Counterfeit Chips

RAPTOR technology exceeds the performance of traditional tampering detection methods by up to 40%.

Arm Announces Appointment of Young Sohn to its Board of Directors

Arm today announced the appointment of new Board member Young Sohn.

SkyWater Names Bassel Haddad as Sr. Vice President and General Manager of Advanced Packaging

SkyWater Technology today announced the appointment of Bassel Haddad as senior vice president and general manager of advanced packaging.

Intel Awarded up to $3B by the Biden-Harris Administration for Secure Enclave

The Biden-Harris Administration announced today that Intel Corporation has been awarded up to $3 billion in direct funding under the CHIPS and Science Act for the Secure Enclave program.

NHanced Semiconductors President Robert Patti to Deliver Keynote at IEEE 3DIC Conference in Sendai, Japan

At the upcoming IEEE International 3D Systems Integration Conference (3DIC), NHanced Semiconductors president Robert Patti will deliver a keynote address detailing the critical role of advanced packaging in continuing the progress of Moore’s Law in semiconductor development.

Samsung Begins Industry’s First Mass Production of QLC 9th-Gen V-NAND for AI Era

Samsung Electronics today announced it has begun mass production of its one-terabit (Tb) quad-level cell (QLC) 9th-generation vertical NAND (V-NAND).

PPG Launches PPG STEELGUARD 951 Fire Protection Coating in the Americas

PPG today announced the launch of PPG STEELGUARD 951 epoxy intumescent fire protection coating in the Americas.

What’s in the August/September Issue?

Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the August/September issue.

Infineon Pioneers World’s First 300mm Power GaN Technology

Infineon Technologies AG today announced that the company has succeeded in developing the world’s first 300mm power gallium nitride (GaN) wafer technology.

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