Alpha and Omega Semiconductor Limited, a designer, developer, and global supplier of a broad range of discrete power devices, wide band gap power devices, power management ICs, and modules, today announced its new highly robust power MOSFET LFPAK 5×6 package.
Packaging
Pfeiffer Vacuum Achieves Gold Medal in EcoVadis Sustainability Ranking
Pfeiffer Vacuum, a member of the global Busch Group, has once again been awarded the prestigious EcoVadis Gold Medal for its site in Asslar.
Pfeiffer Vacuum Introduces New HiQuad Neo Mass Spectrometer
With its new HiQuad Neo mass spectrometer, Pfeiffer Vacuum combines powerful performance with flexibility and user-friendly operation.
Diraq Drives Two-Qubit Gate Accuracy in CMOS to Above 99%
Diraq announced it has successfully demonstrated consistent and repeatable operation with above 99% fidelity of two-qubit gates in the SiMOS (silicon metal-oxide-semiconductor) quantum dot platform.
OKI Sets Up New PCB Manufacturing Line for Semiconductor Manufacturing and Testing Equipment at Joetsu Plant
The OKI Group PCB business company OKI Circuit Technology has set up a new ultra-high-multilayer PCB line at the Joetsu Plant in Joetsu City, Niigata Prefecture, with full-scale operations commencing in July.
2025 IEEE Electronic Components and Technology Conference Announces Call for Papers
The IEEE Electronic Components and Technology Conference (ECTC), the premier technical conference and product exhibition for the world’s semiconductor packaging industry, has announced a Call for Papers for ECTC 2025, the conference’s 75th anniversary.
Greene Tweed Highlights ONX 600 for Semiconductor Applications
This material provides peak durability, performance, and safety in critical environments.
Archer Sends New Biochip gFET Design for Manufacture to Bolster Functionality
Archer Materials Limited, a semiconductor company advancing the quantum technology and medical diagnostics industries, has sent a new graphene field effect transistor (gFET) design for its Biochip to VTT Technical Research Centre of Finland Ltd for manufacture 200mm diameter wafers via a MPW run for integration with CMOS readout.
Veeco Announces Agreement with IBM to Explore Wet Processing Systems for Advanced Packaging Applications
Veeco Instruments Inc. (NASDAQ: VECO) today announced that IBM selected the WaferStorm Wet Processing System for Advanced Packaging applications and has entered into a joint development agreement to explore advanced packaging applications using multiple wet processing technologies from Veeco.
IMAPS 57th International Symposium on Microelectronics Planned for September 30 – October 3, 2024, in Boston
The 57th International Symposium on Microelectronics (IMAPS 2024) will be held September 30 – October 3, 2024, at the Encore Boston Harbor in Boston, Massachusetts.
