Synopsys, Inc. today announced that Juniper Networks has adopted the Synopsys OptoCompiler platform, including the OptSim and PrimeSim HSPICE simulation solutions, to accelerate the development of photonic-enabled chips for the next generation of optical communications.
Packaging
Heterogeneous Integration Chip-let System Package Alliance Established to Expand Market Opportunities
In order to enhance critical capabilities of Taiwan’s chip industry for this emerging market, the Department of Industrial Technology (DoIT), Ministry of Economic Affairs (MOEA), Taiwan, has supported ITRI to establish the Heterogeneous Integration Chip-let System Package Alliance (Hi-CHIP).
Researchers Uncover the Mechanism of Electric Field Detection in Microscale Graphene Sensors
The ability to sense the magnitude and polarity of the electric field is of great scientific interest. It has various real-life applications, such as early prediction of lightning and detection of supersonic aircraft.
SEMI Urges Upcoming French Presidency of the Council of the European Union to Make Semiconductor Industry a Top Priority
SEMI, the global industry association that unites the entire electronics manufacturing and design supply chain, urged closer cooperation among European Union member states on technology and prioritization of semiconductor technology ahead of the French Presidency of the Council of the European Union that begins January 1, 2022.
Nepes Laweh to Set New Industry Benchmark With 600mm Large Panel M-Series Fan-Out Volume Production
Nepes Laweh Corporation announced the successful production of the world’s first 600mm x 600mm large Panel Level Packaging (PLP) using Deca’s M-Series fan-out technologies.
Micron Appoints Rob Beard as SVP
Micron Technology, Inc. announced the appointment of Rob Beard as senior vice president, general counsel and corporate secretary.
GlobalFoundries Announces Extension of AMD Wafer Supply Agreement to Guarantee Supply
GlobalFoundries Inc. (Nasdaq: GFS) (GF) today announced that it has agreed to amend its Wafer Supply Agreement (WSA) with AMD to increase the volume of chips GF will supply as well as extend the terms of the agreement to secure supply through 2025.
SEMICON Taiwan 2021 Opens Tomorrow with Smart and Green Manufacturing, Heterogeneous Integration and Compound Semiconductors in Focus
The latest advances in compound semiconductors, heterogeneous integration, smart manufacturing and green manufacturing will take center stage December 28-30 at SEMICON Taiwan 2021 as industry leaders and visionaries gather at the Nangang Exhibition Center, Hall I (TaiNEX 1) for the latest innovations and trends driving microelectronics industry growth.
inTEST Closes Acquisition of Acculogic
inTEST Corporation announced today that it has completed its acquisition of Acculogic, Inc. and its affiliates.
Navitas GaN ICs: Most Protected, Reliable and Robust Power Semiconductors for Mobile Fast Chargers
Navitas Semiconductor, a developer of gallium nitride (GaN) power integrated circuits (ICs) announced that its GaNFast power ICs with GaNSense technology have been upgraded to increase efficiency, power density, and access additional fast-charger markets.
