The collaboration will leverage EVG’s nanoimprint lithography (NIL) technology, expertise and services with Teramount’s PhotonicPlug technology.
Packaging
Micron Delivers World’s Most Advanced 176-Layer NAND Data Center SSD
Micron Technology, Inc., today announced it is sampling the world’s first vertically-integrated 176-layer NAND solid-state drive (SSD) for the data center.
CEVA Announces Milestone of 100 Million CEVA-powered Cellular IoT Chips Shipped
CEVA, Inc., the licensor of wireless connectivity and smart sensing technologies and integrated IP solutions, today announced that more than 100 million CEVA-powered cellular IoT chips have been shipped by CEVA licensees since the beginning of 2020.
Process Insights Announces the Acquisition of Guided Wave Inc.
Process Insights, a Union Park Capital portfolio company, announced today that it has acquired Guided Wave Inc. from Singapore-based Advanced Holdings Ltd.
Key Foundry Begins Mass Production of Power Semiconductors Using 0.18 micron High Voltage BCD Process
Key Foundry, the only pure-play foundry in Korea, announced today that it has begun the mass production using its 0.18 micron high voltage BCD (Bipolar-CMOS-DMOS) process.
SEMI Survey Highlights Member Recommendations for U.S. Chip Industry Competitiveness, Government Investment
SEMI, the industry association representing the global electronics design and manufacturing supply chain, today released the results of a survey of more than 400 U.S. member companies that highlight challenges facing the semiconductor industry.
Kioxia to Acquire Chubu Toshiba Engineering
Kioxia Holdings Corporation has entered into a definitive agreement with Toshiba Digital Solutions Corporation to acquire all of the outstanding shares of its subsidiary, Chubu Toshiba Engineering (CTE) Corporation, to further strengthen Kioxia Group’s technology development capabilities.
SIA Statement on Sanctions on Russia
The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer regarding new export control rules announced today in response to Russia’s invasion of Ukraine.
Secure-IC Launches a Unique Cybersecurity Lifecycle Management Platform for Connected Objects
After recently announcing its capital raise to support its “Chip to Cloud” vision, Secure-IC, the provider of end-to-end cybersecurity solutions for embedded systems and connected objects announced today the launch of a unique cybersecurity lifecycle management platform for connected objects (Securyzr integrated Security Services Platform).
Count of Semiconductor Fabs Using 300mm Wafers Projected to Exceed 200 by 2026
At the end of 2021, there were 153 semiconductor fabs processing 300mm wafers for the fabrication of ICs, including CMOS image sensors, and non-IC products such as power discretes.
