POET Technologies Inc., the designer and developer of the POET Optical Interposer and Photonic Integrated Circuits (PICs) for the data center and tele-communication markets, today announced a collaboration with Liobate Technologies to incorporate advanced Thin-Film Lithium Niobate modulators onto POET’s Optical Engines supporting power-efficient ultra-high-bandwidth electro-optic conversion for data center and telecom applications.
Packaging
Manoj R. Shah, Former Professor of Practice at Rensselaer Polytechnic Institute, Elected to the National Academy of Engineering
Manoj R. Shah, former Professor of Practice at Rensselaer Polytechnic Institute, has been elected to the National Academy of Engineering (NAE) for his “technical advancements in design, analysis, and applications of electric machines.”
Supplyframe Consumer Research Highlights Shifting Car Buying Behaviors, Consumer Sentiment About the Automotive Industry
Supplyframe today released research indicating that most consumers anticipate negative fallout from supply chain shortages fueled by the pandemic to continue throughout 2022.
Worldwide Semiconductor Assembly and Test Facility Database Now Tracks Integrated Device Manufacturers, 475 Facilities
SEMI and TechSearch International today announced a new edition of the Worldwide Assembly & Test Facility Database offering significantly expanded coverage that now includes integrated device manufacturer (IDM) facilities.
Imec, KU Leuven and PragmatIC Semiconductor Demonstrate Fastest 8-bit Flexible Microprocessor for Low-Power Applications
This week, at the 2022 International Solid-State Circuits Conference (2022 ISSCC), imec, a research and innovation hub in nanoelectronics and digital technologies, KU Leuven, and PragmatIC Semiconductor, a developer of flexible electronics, present the fastest 8-bit microprocessor in 0.8µm metal-oxide flexible technology capable of running real-time complex assembly code.
Metal Mix and Match: An Unexpected Discovery Could Improve the Crystallinity of Coordination Nanosheets
Scientists develop a simple strategy to enhance the structural properties of coordination nanosheets by mixing two metal ion solutions together, using a powerful organic ligand.
Intel Names Christoph Schell Executive Vice President and Chief Commercial Officer
Schell joins Intel to help drive customer and partner success and capitalize on the largest opportunity in the company’s history.
LET-a CeMAT ASIA Event 2022
LET-a CeMAT ASIA event is the biggest intelligent logistics equipment and technology trade fair in South China.
Advanced Packaging Market Worth $55B, Globally, by 2028 at 8% CAGR
The advanced packaging market to grow at a CAGR of 8% to reach $55 billion by 2028 from ~$30 billion in 2020.
ACM Research Receives Orders for Ultra ECP map and Ultra ECP ap Copper Plating Systems
ACM Research, Inc., a supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, today announced purchase orders for 13 Ultra ECP map and 8 Ultra ECP ap copper plating systems, of which 10 tools are repeat orders from a top-tier Chinese foundry.
