JEDEC Solid State Technology Association today announced the publication of JEP200: Test Methods for Switching Energy Loss Associated with Output Capacitance Hysteresis in Semiconductor Power Devices.
Packaging
Paul V. Walsh, Jr. Joins Kopin Corporation Board of Directors
Kopin Corporation today announced that Paul V. Walsh, Jr. has joined Kopin Corporation’s Board of Directors.
ACM Research Expands Fan-Out Panel-Level Packaging Portfolio with Launch of Ultra C bev-p Bevel Etching Tool
New double-sided bevel etching system enhances process efficiency and reliability in copper-related applications, supporting high-precision features on large panels.
ROHM and UAES Sign a Long-Term Supply Agreement for SiC Power Devices
ROHM Semiconductor and United Automotive Electronic Systems Co., Ltd. (UAES), a Tier 1 automotive supplier in China, today announced they have entered into a long-term supply agreement for SiC power devices.
Micron Introduces HBM3E 12-high 36GB
Micron’s HBM3E 12-high 36GB delivers significantly lower power consumption than other 8-high 24GB offerings, despite having 50% more DRAM capacity in the package.
DELO Introduces New Microelectronics Adhesive for Ultra-Fine Structures
DELO has developed a new adhesive that can be used to create ultra-fine structures within seconds.
ACM Research Receives Orders for Wafer-Level Packaging Tools from U.S. Customer and R&D Center
ACM Research, Inc. today announced it has received purchase orders for four wafer-level packaging tools, including two from a U.S.-based customer and two from a U.S.-based research and development (R&D) center.
A New Advancement in Photonic Chips Set to Unlock an Industry
Researchers from TMOS, the ARC Centre of Excellence for Transformative Meta-Optical Systems, have developed a new engineering approach to on-chip light sources that could lead to widespread adoption of photonic chips in consumer electronics.
SEMICON India 2024 to Highlight Local Semiconductor Ecosystem Growth and Industry Trends from September 11-13
SEMICON India 2024 will bring together global leaders, semiconductor industry experts, academia, and government officials from September 11-13, 2024, at the India Exposition Mart Ltd. (IEML) in Greater Noida, Delhi NCR.
Onto Innovation Announces Opening of Packaging Applications Center of Excellence
Customers and collaborators will have early access to next-generation glass substrate tools and software solutions to accelerate panel-level packaging R&D.
