Tachyum today announced the final build of its Prodigy FPGA emulation system in advance of chip production and general availability next year.
Packaging
Movellus Joins the Silicon Catalyst In-Kind Partner Ecosystem
Movellus today announced that it has joined the Silicon Catalyst ecosystem as the newest member of their In-Kind Partner (IKP) network.
Microchip and Acacia Collaborate to Enable Optimized Terabit-Scale Data Center Interconnect Systems
The companies enable an interoperable coherent optics ecosystem that can help streamline the development of data center interconnect and metro transport systems.
SIA Applauds CHIPS Act Incentives for SK hynix
The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer applauding semiconductor manufacturing incentives announced by the U.S. Commerce Department and SK hynix.
Akoustis Announces Leadership Transition
Akoustis Technologies, Inc. announced today the mutually agreed resignation of Jeffery B. Shealy as Chief Executive Officer and as a member of the Board of Directors, effective August 6, 2024.
ACM Research Strengthens its Fan-Out Panel Level Packaging Portfolio with Launch of Ultra ECP ap-p Tool
ACM Research, Inc., a supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging applications, today announced its new Panel Electrochemical Plating (Ultra ECP ap-p) tool designed for fan-out panel-level packaging (FOPLP).
New Substrate Material for Flexible Electronics Could Help Combat E-Waste
Electronic waste is a rapidly growing problem, but this degradable material could allow the recycling of parts from many single-use and wearable devices.
New SEMI Foundation and Policy Equity Group Collaboration Earns Funding to Address Semiconductor Industry Child Care Gaps
Seeking to bolster the semiconductor industry workforce in the U.S. by addressing gaps in child care needs, the SEMI Foundation and Policy Equity Group today announced a collaboration to help companies comply with child care requirements under the U.S. CHIPS and Science Act.
U.S. Department of Commerce Announces Funds to SK hynix’s AI Memory Chip Facility
The preliminary memorandum of terms between the South Korean semiconductor manufacturer and the U.S. Department of Commerce will support high-bandwidth-memory AI chip production and advanced packaging R&D.
NEO Semiconductor Announces the Development of its 3D X-AI Chip
NEO Semiconductor, a developer of innovative technologies for 3D NAND flash memory and 3D DRAM, announced today the development of its 3D X-AI chip technology, targeted to replace the current DRAM chips inside high bandwidth memory (HBM) to solve data bus bottlenecks by enabling AI processing in 3D DRAM.
