Samsung Electronics Co., Ltd. today announced that five of its memory products achieved global recognition for successfully reducing its carbon emission, while 20 additional memory products received carbon footprint certification.
Packaging
SIA Applauds Bicameral Agreement on Path Forward for USICA
Senate-passed legislation includes $52 billion to fund the semiconductor manufacturing, research, and design provisions in the CHIPS for America Act.
Qualcomm CEO Cristiano Amon Elected Chair of Semiconductor Industry Association
The Semiconductor Industry Association board of directors today elected Cristiano Amon, president and CEO of Qualcomm Incorporated, as its 2022 chair.
Aehr Test Systems Joins PowerAmerica Institute to Support Advancing SiC & GaN Tech for Next-Gen Power Electronics, Electric Vehicles
Aehr Test Systems, a supplier of semiconductor test and reliability qualification equipment, announced today that it has joined the PowerAmerica Institute (PowerAmerica), a public-private research initiative dedicated to accelerating the adoption of high performing, next generation silicon carbide (SiC) and gallium nitride (GaN) power electronics.
JCET Expands Production Capacity in Suqian
JCET Group, a global integrated-circuit manufacturing and technology service provider, announced the official opening of the second phase of its IC packaging and testing facility in Suqian.
Chroma Releases the Newest Semiconductor Test Solution
Chroma ATE Inc., a supplier of precision Test and Measurement Instrumentation, Automated Test Systems, Intelligent Manufacturing Systems, Turnkey Test and Automation Solutions has recently released the newest semiconductor test solution for the IoT IC market.
Power Module Packaging Market Will Grow to Around US$3.5B by 2026
In 2020, motor drives represented the most significant power module market with a value of US$1.6 billion.
CEA-Leti Unveils Breakthrough for Mass-Market, High-Performance, Navigation-Grade Gyroscopes
CEA-Leti scientists, in collaboration with researchers at Politecnico di Milano have developed the world’s smallest-footprint MEMS gyroscope that is capable of providing navigation-grade performance.
Power Semiconductor Innovator GaN Systems Announces $150 Million in Growth Capital Funding
GaN Systems today announced a US $150 million growth capital funding round to accelerate innovation and adoption of GaN technology across its automotive, consumer, industrial, and enterprise markets.
Annual Revenue Growth to Skyrocket Among Top 25
Big gains in artificial intelligence, machine learning, 5G infrastructure provide strong boost to sales growth at AMD, MediaTek, Nvidia, and Qualcomm this year; declines for Intel and Sony.
