Watlow, a designer and manufacturer of complete thermal systems, announced that its facility in Winona, MN was selected by the Winona Chamber of Commerce as ‘Business of the Year.’
Packaging
Watlow New STREAMLINE Heating System with ATS Technologies Reduces the Complexity Associated with Legacy Systems on a Semiconductor Tool
Watlow, a designer and manufacturer of complete thermal systems, announced the launch of its new STREAMLINE Heating System featuring Adaptive Thermal Systems (ATS) technologies.
Lam Research Appoints Jyoti Mehra to Board of Directors
Lam Research Corporation today announced Jyoti Mehra has joined its board of directors, effective November 9th.
2021 Silicon Parts Demand Outstrips Supply as Market Grows >30%
TECHCET announced silicon parts demand is outpacing supply given pandemic-induced needs for increased safety stocks and high chip production.
SUSS MicroOptics Wins the Swiss Manufacturing Award 2021
The University of St. Gallen in Switzerland recognizes SUSS MicroOptics with the “Swiss Manufacturing Award” for its outstanding contribution to Switzerland’s manufacturing ecosystem.
Alpha and Omega Semiconductor Introduces Latest 80V Power MOSFET With Shield Gate Technology
The new 80V Power MOSFET technology has lower switching losses in hard switching, topologies and have less voltage overshoot than the previous generation.
Acorn and UCLouvain Professor Collaborate on Groundbreaking Silicon-on-Insulator Research Project
Acorn Technologies today announced a research collaboration with Jean-Pierre Raskin, PhD, a full professor at the Université catholique de Louvain (UCLouvain), Belgium’s largest French-speaking university.
ERS Now Offers its Technology for Fan-out Debonding and Warpage Adjustment in a Fully-Automatic Machine for Panels up to 650 x 650 mm
ERS electronic, a developer of thermal management solutions for semiconductor manufacturing, is adding the Automatic Panel Debond Machine 650 (APDM650) to its portfolio of equipment for Advanced Packaging
YES Announces Strategic Partnership with Osiris for Edge Film Removal Technology
YES (Yield Engineering Systems, Inc.), a manufacturer of process equipment for semiconductor advanced packaging, life sciences and “More-than-Moore” applications, today announced that it has signed an exclusive agreement with Osiris (Osiris International GmbH) to license its smartEBR technology for edge bead removal on panels.
Fraunhofer ENAS Successfully Manufactures Ultra-Thin and Highly Flexible Parylene-Based Printed Circuit Boards with Several Metallization Layers
Scientists at the Fraunhofer Institute for Electronic Nano Systems ENAS in Chemnitz successfully developed and manufactured flexible printed circuit boards with an overall thickness of less than 20 micrometers and several metallization layers based on the polymer Parylene. The institute presents the new generation of flexible PCB this fall at the COMPAMED and the SEMICON Europa 2021.
