SUSS MicroTec and SET announce a partnership in sequential die-to-wafer (D2W) hybrid bonding, a die-based interconnect technology, to provide a fully automated, customizable, highest-yield equipment to customers.
Packaging
Renesas Expands Satellite Communications Portfolio with Industry’s First Commercial Dual-Beam Active Beamforming IC Lineup
Renesas Electronics Corporation (TSE:6723), a supplier of advanced semiconductor solutions, today expanded its portfolio of mmWave LNAs and Tx BFICs with the introduction of three new dual-beam active beamforming ICs.
SEMICON Europa 2021 Opens Tomorrow with Executive Forum, Smart Technologies and Digital Transformation in Spotlight
SEMICON Europa 2021, Europe’s premier gathering of the entire electronics design and manufacturing supply chain, opens tomorrow for the latest insights from visionaries and industry leaders on smart technologies, digital transformation, and how the microelectronics industry can enable a secure and sustainable digital future.
Classiq to Collaborate with The Fraunhofer Institute
Classiq, which provides a breakthrough Quantum Algorithm Design platform, announced today that it is collaborating with the Fraunhofer Institute, an applied research organization in Europe, as well as other major academic centers, on the development of software for industrial use of quantum computers.
Stanford Professors to be Honored for Excellence in Semiconductor Research
The Semiconductor Industry Association (SIA) and the Semiconductor Research Corporation (SRC) today announced two Stanford University professors are the 2021 recipients of SIA-SRC University Research Awards: Dr. Subhasish Mitra, Professor of Electrical Engineering and of Computer Science, and Dr. Boris Murmann, Professor of Electrical Engineering.
SkyWater President and CEO, Thomas Sonderman, to Serve as Panelist at Purdue Workshop for Microelectronics and Advanced Packaging Workforce Development
SkyWater Technology (NASDAQ: SKYT) announced that its President and CEO, Thomas Sonderman, is serving as a panelist today at Purdue University’s Microelectronics and Advanced Packaging Workforce Development Workshop in West Lafayette, Indiana.
High Current Rated TOLL MOSFETs from Diodes Incorporated Target EV Applications
Diodes Incorporated has introduced a portfolio of automotive MOSFETs packaged in the space saving, thermally-efficient TOLL package.
Samsung Announces Availability of Its Leading-Edge 2.5D Integration ‘H-Cube’ Solution for High Performance Applications
Samsung Electronics today announced that it has developed Hybrid-Substrate Cube (H-Cube) technology, its latest 2.5D packaging solution specialized for semiconductors for HPC, AI, data center, and network products that require high-performance and large-area packaging technology.
After Strong Gains, DRAM Prices Expected To Retreat in 4Q21
DRAM buyers cautious about placing significant orders; opting instead to keep inventory in check.
NXP and Ford Collaborate to Deliver Next-Generation Connected Car Experiences and Expanded Services
NXP Semiconductors today announced a collaboration with the Ford Motor Company to deliver enhanced driver experiences, convenience and services across its global fleet of vehicles, including the 2021 Ford F-150 pickup, Mustang Mach-E and Bronco SUVs.
