With AMD’s announcement of its Elevated Fanout Bridge (EFB) GPU package, the embedded bridge for fan-out (FO) on substrate is in the spotlight.
Packaging
Primo1D Raises 15M Euros for Industrial-Scale Deployment
Primo1D today announced a new funding round of 15 million euros from major French capital funds.
aveni, SA Secures Patent For Groundbreaking, One-Step 3D NAND Wet Deposition Process That Replaces ALD And CVD Technologies
aveni SA today announced that it has secured a patent that can extend the industry standard of layers from 100 to 200+ layers on a single wafer for 3D NAND memory devices.
Samsung Develops Industry’s First LPDDR5X DRAM
Samsung Electronics Co., Ltd. today announced that it has developed the industry’s first 14-nanometer (nm) based 16-gigabit (Gb) Low Power Double Data Rate 5X (LPDDR5X) DRAM, designed to drive further growth throughout the high-speed data service applications including 5G, artificial intelligence (AI) and the metaverse.
What’s in the November Issue?
Each issue of Semiconductor Digest has articles found only in the magazine! Read the November issue…
Navitas Highlights Electrification Opportunities for Next-Gen Semiconductors at Baird Global Industrial Conference
Navitas Semiconductor, a developer of gallium nitride (GaN) power integrated circuits, has announced that it will take part in Baird’s 2021 Global Industrial Conference on November 11th.
Pure Storage Partners with Microsoft Azure to Speed Semiconductor Design
Pure Storage today announced it has partnered with Microsoft Azure to significantly speed next-gen chip design by delivering a data layer that can keep up with massive, concurrent high-performance computing (HPC) workloads running in the cloud.
Amkor Technology Announces Plans to Expand Advanced Packaging Technology Capacity with New Factory in Bac Ninh, Vietnam
Amkor Technology, Inc., a provider of semiconductor packaging and test services, today announced that it plans to build a smart factory in Bac Ninh, Vietnam.
Global Semiconductor Alliance Announces 2021 Award Nominees
The Global Semiconductor Alliance (GSA) announced its 2021 award nominees. The prestigious awards will be presented at GSA’s Virtual Awards Celebration on Thursday, Dec. 9, 2021.
French Semiconductor Ecosystem: Design House IC’Alps Raises €4.2 Million To Sustain Business Growth For Custom Chip Design
Acting on General Shareholders Meeting, semiconductor company IC’Alps announced today it has raised €4.2 Million from French industrial group DOLIAM.
