The BMW Group is exploring new ways of working with suppliers and, in the case of strategically important components, becoming more closely involved in the supplier network.
Packaging
Everspin Technologies Wins SEMI Americas Award at SEMICON West 2021 Hybrid
Everspin Technologies, a leading worldwide producer of Magnetoresistive random access memory (MRAM) nonvolatile solutions for the world’s mission-critical memory applications, has won the 2021 SEMI Americas Award, SEMI announced today at SEMICON West 2021 Hybrid in San Francisco.
Intel Launches Integrated Photonics Research Center
Intel Labs recently opened the Intel Research Center for Integrated Photonics for Data Center Interconnects.
Microchip to Provide Silicon Carbide MOSFETs and Digital Gate Drivers for Mersen’s SiC Power Stack Reference Design
Microchip Technology Inc. today announced the collaboration with Mersen on their 150 kilovolt-ampere (kVA) three-phase silicon carbide Power Stack Reference Design.
Semiconductor Market Has Surpassed $150B in a Single Quarter as Samsung Takes Over Top Spot in Revenue Ranking
Semiconductor revenue rose 7.6% in Q3 2021 from Q2 2021 and climbed above $150 billion in revenue during a single quarter for the first time since research group Omdia began tracking the market in 2002.
Increasing Fab Productivity with New Chamber Solutions
To speed throughput, equipment makers such as Applied Materials, Lam and TEL have implemented new tools that are smarter and denser.
Gartner Predicts Chip Shortages Will Drive 50% of the Top 10 Automotive OEMs to Design Their Own Chips by 2025
By 2025, chip shortages and trends such as electrification and autonomy will drive 50% of the top 10 automotive original equipment manufacturers (OEMs) to design their own chips, according to Gartner, Inc. As a result, it will give them control over their product roadmap and supply chains.
‘Unprecedented Collaboration’ – Department of Commerce Deputy Secretary Addresses CHIPS Act and Asks for Industry Coordination
Deputy Secretary Don Graves of the U.S. Department of Commerce joined SEMI President Ajit Manocha on the keynote stage Tuesday morning to share the current status of the CHIPS Act, as well as address the current struggles of the chip supply chain.
DNP Develops Interposer, a Primary Component in Next-Generation Semiconductor Packaging
Dai Nippon Printing Co., Ltd. has developed an interposer, a high-performance intermediate device that electrically connects multiple chips and substrates.
Chip Shortages Continue, but What About EDA Tools? Here Are Three Reasons for Optimism
Charles Shi from Needham and Company sees EDA growth accelerating as Moore’s Law slows down.
