Local and state officials joined the executive leadership of Swagelok Company for a ribbon cutting ceremony celebrating the completion of Swagelok’s Global Headquarters and Innovation Center.
Packaging
Rescheduled to Dec. 28-30: SEMICON Taiwan 2021 to Highlight Semiconductor Industry Growth Opportunities
Semiconductor leaders and visionaries will convene December 28-30 at SEMICON Taiwan 2021 for insights into the latest innovations that will drive the next wave of industry growth as the event, the region’s premier gathering of the entire electronics manufacturing and design supply chain, returns to the Taipei Nangang Exhibition Center, Hall 1.
Valens Semiconductor and PTK Acquisition Corp. Announce Closing of Business Combination
Valens Semiconductor, Ltd. and PTK Acquisition Corp. today announced the completion of their previously announced business combination.
Ultrathin Quantum Dot LED That Can Be Folded Freely As Paper
Quantum dot light-emitting diode (QLED), which employs quantum dots as a light-emitting material, has attracted significant attention as a promising alternative for next-generation display technologies, owing to its outstanding electroluminescence properties.
Paragraf Appoints Charles Platts as CFO
Paragraf, a manufacturer in the development and production of graphene electronic devices, has appointed Charles Platts as Chief Finance Officer.
“How Long Will It Last?” Heightened Demand for Plating in Advanced Packaging & Front-End (FE)/Damascene Chemicals
Healthy growth through 2022, but softening expected in 2023.
Navitas and BRUSA Announce Development Partnership to Accelerate EV Adoption
Navitas Semiconductor and BRUSA HyPower AG announced a technology development partnership to accelerate EV adoption of Navitas GaN power ICs to reduce the size and weight of power electronic components that are used for EV charging.
New Technique Speeds Measurement of Ultrafast Pulses
University of Rochester researchers have developed a time-domain single-pixel imaging technique to speed the measurement of ultrafast pulses in infrared and far infrared wavelengths
Truphone Enables Mass IoT Deployments With iSim Collaboration
Truphone announces that in collaboration with Sony Semiconductor Israel and Kigen, Truphone has successfully enabled its IoT platform and global connectivity to run on the integrated SIM of Sony’s Altair cellular IoT chipsets, powered by Kigen iSIM OS.
Panel-Level Heterogeneous Integration Technology for Analog ICs
Micro-transfer printing, a massively parallel pick-and-place process, may be used to produce HI analog ICs comprised of large arrays of ultra-thin separately manufactured components interconnected using redistribution layer technology.
