Toshiba has introduced two photocouplers, “TLP5705H” and “TLP5702H,” housed in a thin SO6L package, for use as insulated gate drivers for small to medium capacity IGBTs/MOSFETs.
Packaging
SEMICON West 2021 to Gather Visionaries to Explore New Semiconductor Supply Chain Strategies and Opportunities
Future implications of ongoing global supply chain disruptions will take the spotlight as U.S. Deputy Secretary of Commerce Don Graves joins SEMI President and CEO Ajit Manocha for opening remarks at SEMICON West 2021 Hybrid, December 7-9 at the Moscone Center in San Francisco.
A*STAR’s Institute of Microelectronics and STMicroelectronics Team Up on Silicon Carbide R&D for the EV Market and Industrial Applications
The Institute of Microelectronics (IME) at the Agency for Science, Technology and Research (A*STAR) and STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, announced the start of a Research & Development (R&D) collaboration in the field of silicon carbide (SiC) for power-electronics applications in the automotive and industrial markets.
Advantest Announces New Versatile, High-Throughput Test Solution for NAND/Nonvolatile Flash Memory ICs
Semiconductor test equipment supplier Advantest Corporation (TSE: 6857) has introduced a new high-throughput memory tester for NAND flash devices that can perform functional testing of chips while delivering highly accurate timing, repeatability and failure detection.
CyberOptics to Deliver Technical Presentation About the Importance of 3D Inspection for Advanced Packaging at SEMICON Taiwan
CyberOptics Corporation (NASDAQ: CYBE), a developer and manufacturer of high-precision 3D sensing technology solutions will share a technical presentation at the Heterogeneous Integration Global Summit organized by SEMICON Taiwan Dec 1-3rd.
GaN Systems and USI Form Strategic Partnership to Accelerate GaN Adoption in Electric Vehicles
GaN Systems and USI have signed a strategic partnership agreement to co-develop GaN power modules for the automotive market.
CyberOptics to Deliver Technical Presentation About the Importance of 3D Inspection for Advanced Packaging at SEMICON Taiwan
CyberOptics Corporation, a global developer and manufacturer of high-precision 3D sensing technology solutions will share a technical presentation at the Heterogeneous Integration Global Summit organized by SEMICON Taiwan Dec 1-3rd.
North American Semiconductor Equipment Industry Posts October 2021 Billings
North America-based semiconductor equipment manufacturers posted $3.74 billion in billings worldwide in October 2021 (three-month moving average basis).
Samsung Electronics Expands its ‘Green Chip’ Line-Up
Samsung Electronics Co., Ltd. today announced that five of its memory products achieved global recognition for successfully reducing its carbon emission, while 20 additional memory products received carbon footprint certification.
SIA Applauds Bicameral Agreement on Path Forward for USICA
Senate-passed legislation includes $52 billion to fund the semiconductor manufacturing, research, and design provisions in the CHIPS for America Act.
