The manufacturing technique invented by the Stanford team makes it possible to create flexible and atomically thin transistors that are several times smaller than previous efforts.
Packaging
Rambus Completes Acquisition of PLDA
Rambus Inc., a provider of chips and silicon IP making data faster and safer, today announced the completion of the acquisition of PLDA.
GlobalFoundries Sets “Journey to Zero Carbon” Goal to Reduce Greenhouse Gas Emissions by 25% while Expanding Global Manufacturing Capacity
GlobalFoundries today announced its goal to reduce greenhouse gas emissions by 25% from 2020 to 2030, as the company expands its global manufacturing capacity.
QP Technologies Installs New Wire Bonders, Broadening Reach in Mil-Aero, RF, Power Markets
QP Technologies (formerly Quik-Pak), a provider of microelectronic packaging and assembly solutions, today announced it has installed two new Hesse Mechatronics ultrasonic wire bonders at its wholly owned 20,000-square-foot facility.
2021 IEEE International Electron Devices Meeting Highlights Educational Opportunities in Leading-Edge Semiconductor Technologies
While the comprehensive technical program for the 2021 IEEE International Electron Devices Meeting (IEDM) will be finalized in the fall, the popular IEDM Tutorials and Short Courses are already set. The broad reach, interdisciplinary nature and technical depth of the topics that will be discussed in these educational events can serve as a “crystal ball” of sorts to show where the industry is headed. For those who wish to get…
A Holistic Approach to Materials for the Next Generation of Electrical Insulation
Researchers from The University of Texas at Austin in collaboration with the U.S. Army Research Lab are analyzing new materials for electrical insulation, or packaging, that can remove heat more effectively compared to today’s insulation, amid a need to redesign our electrical infrastructure for the next 100 years and beyond to match advanced technology.
IAR Systems Collaborates with NSITEXE
IAR Systems, the future-proof supplier of software tools and services for embedded development, today announced its partnership with NSITEXE.
NVIDIA Founder and CEO Jensen Huang to Receive Semiconductor Industry’s Top Honor
The Semiconductor Industry Association (SIA) today announced Jensen Huang, founder and CEO of NVIDIA and a trailblazer in building accelerated computing platforms, is the 2021 recipient of the industry’s highest honor, the Robert N. Noyce Award.
Automotive MCU Sales to Surge 23% in 2021 Despite Shortages
32-bit designs are expected to generate almost 77% of automotive microcontroller revenues this year, followed by 18% from 16-bit and 6% from 8-bit, says Mid-Year Update report.
Samsung Introduces the Industry’s First 5nm Processor Powering the Next Generation of Wearables
Samsung Electronics Co., Ltd. today announced its new wearable processor, the Exynos W920.
