James Huang, Vice President of R&D, Alchip Technologies sees a chiplet revolution as the cost-effective extender of Moore’s Law.
Packaging
BASF and Entegris Sign Agreement on the Sale of Precision Microchemicals Business
BASF and Entegris have signed an agreement on the sale of the Precision Microchemicals business to Entegris for $90 million. The transaction includes technologies, intellectual property and trademarks and is expected to be completed by the end of 2021.
Gel-Pak Wins East Bay Innovation Award for LCS2 Semiconductor Shipping Protection Technology
Gel-Pak, a division of Delphon and worldwide leader in protective carriers for semiconductor, optoelectronic, and medical devices, was honored earlier this month with an East Bay Innovation Award for its new Lid/Clip Super System LCS2TM.
Micron’s New Crucial DDR5 Memory Delivers Blazing Speeds and Massive Bandwidth to Consumers for Next-Gen Desktop PCs
Micron Technology, Inc. today announced the immediate availability of Micron Crucial DDR5 desktop PC memory products that deliver up to 50% faster data transfer speeds over previous-generation DDR4 memory, providing mainstream PC users with enthusiast-level performance.
Maximizing Protection of Flip Chip Interconnects
NCP and NCF property and process optimization deliver high-reliability results.
Supplyframe CIQ Suggests Chip Supply Stabilization Will Not Begin Until 1H 2023
The number of commodity dimensions with red status grew again as the industry entered the fourth quarter of 2021, according to the latest Supplyframe Commodity IQ.
ETEL’s New ST Stroke Actuators Offer Higher Performance in Back-end Semiconductor Manufacturing
ETEL introduced two new short stroke actuators specifically for use as a unique solution for “Test and Scan” turret handlers in semiconductor manufacturing.
Brooks Instrument to Showcase New Pressure-Based Mass Flow Controller at SEMICON EUROPA 2021
Brooks Instrument will feature its new GP200 Series pressure-based mass flow controller (P-MFC) at SEMICON Europa, November 16-19, in Munich, Germany.
Cadence Digital and Custom/Analog Flows Achieve the Latest TSMC N3 and N4 Certifications
Cadence Design Systems, Inc. today announced that its digital and custom/analog flows have achieved certification for TSMC’s N3 and N4 process technologies in support of the latest Design Rule Manual (DRM).
New ISO 26262 Functional Safety Packages Simplify Design of ASIL B and ASIL C Safety Applications
Microchip Technology Inc. is offering newly certified functional safety packages to enable engineers to develop their products as per the ISO 26262 functional safety standard.
