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Mouser Receives Outstanding Partnership Award from Epson America

Epson presented Mouser’s Ben Venator and Melinda Harper with the award for continued increases in market share and customer count.

Winbond and Synopsys Deliver Complete High-Density NAND Flash Memory Solution

Winbond Electronics today announced the successful interoperability of Synopsys’ DesignWare Synchronous Serial Interface (SSI) IP and Winbond’s OctalNAND Flash Memory.

Coalition Calls on Congress to Invest in Domestic Semiconductor Manufacturing, Research, Design

The SIA – along with a broad coalition of 19 other tech, auto, medical, defense, and other business and labor groups – today in a letter urged Congress to enact funding for the semiconductor manufacturing, research, and design initiatives

Plasma-Therm ‘RANKED 1st’ in VLSI 2021 Survey for Etch & Clean Equipment

Plasma-Therm has once again been named the top supplier of etch and clean equipment for semiconductor manufacturing, according to the results of the 2021 VLSIresearch Customer Satisfaction Survey of worldwide semiconductor industry customers.

Intel Elects Andrea Goldsmith to Board of Directors

Intel Corporation today announced that Andrea Goldsmith, dean of engineering and applied science and professor of electrical and computer engineering at Princeton University, was elected to Intel’s board of directors, effective Sept. 1, 2021.

Phononic Raises $50 Million Growth Financing from Goldman Sachs Asset Management

To support the global demand for Sustainable innovations that address climate change, Phononic, a developer of solid-state cooling and heating technology, today announced that it has secured a significant growth investment led by $50 million from the Sustainable Investing business within Goldman Sachs Asset Management (Goldman Sachs).

TESCAN Launches Next Generation AutoSlicer Module for High Throughput TEM Sample Preparation

TESCAN ORSAY HOLDING a.s. announces its latest generation AutoSlicer module for unattended, semi-automated transmission electron microscope (TEM) lamella preparation in semiconductor failure analysis and materials science.

GlobalFoundries Plans to Build New Fab in Upstate New York in Private-Public Partnership to Support U.S. Semiconductor Manufacturing

GlobalFoundries (GF) today announced its expansion plans for its most advanced manufacturing facility in upstate New York over the coming years.

What’s in the June/July Issue?

Each issue of Semiconductor Digest has articles found only in the magazine! Read the June/July issue…

Scientists Take First Snapshots of Ultrafast Switching in a Quantum Electronic Device

They discover a short-lived state that could lead to faster and more energy-efficient computing devices.

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