Packaging

Nordson Electronics Solutions Completes its Europe Location Move to a New Facility

Nordson Electronics Solutions announced that their Nordson B.V. division, which covers Europe, the Middle East, and Africa, has consolidated its offices into one site in Valkenswaard, The Netherlands, in early July.

Micron Announces Volume Production of Ninth-Generation NAND Flash Technology

Micron Technology, Inc. announced today that it is shipping ninth-generation (G9) TLC NAND in SSDs, making it the first in the industry to achieve this milestone.

Amkor Signs Preliminary Memorandum of Terms with US Department of Commerce for Arizona Advanced Packaging and Test Facility

Amkor Technology, Inc., a provider of semiconductor packaging and test services, announced today it has signed a non-binding preliminary memorandum of terms with the US Department of Commerce to receive proposed funding as part of the CHIPS and Science Act.

IDTechEx Discusses Co-Packaged Optics (CPO) Packaging Technology Trends and Market Trajectory

Over the past decade, the capacity of data center Ethernet switches has surged from 0.64 Tbps to 25.6 Tbps, driven by the adoption of 64×400 Gbps or 32×800 Gbps pluggable optical transceiver modules.

IEEE Leaders Reveal Top Three Technology Megatrends Driving the Need to Upskill and Reskill Employees

2024 Technology Megatrends predicted to boost productivity and future-proof the global workforce are Artificial General Intelligence, Digital Transformation, and Sustainability.

Intel Names Naga Chandrasekaran to Lead Foundry Manufacturing and Supply Chain

Dr. Chandrasekaran succeeds retiring Keyvan Esfarjani as chief global operations officer.

KIOXIA Honored by FMS With Lifetime Achievement Award for 3D NAND Flash Invention

KIOXIA, the inventor of NAND flash memory, is the recipient of the FMS: the Future of Memory and Storage Lifetime Achievement Award for 2024.

Foam Fluidics Showcase Rice Lab’s Creative Approach to Circuit Design

Next-generation soft robotics and wearable technologies could sport foam-based fluidic circuits.

Quantum Transistors Awarded Up to €17.5M by European Innovation Council for Pioneering Solution Enabling Quantum Computing on a Chip

Quantum Transistors  has been awarded up to €17.5 million by the European Innovation Council (EIC). Quantum Transistors received an initial grant from the EIC Accelerator of €2.5 million combined with a future equity investment of €15 million through the EIC Fund.

Pragmatic Semiconductor Appoints Murthy Renduchintala to Board of Directors

Semiconductor veteran joins the FlexIC technology pioneer enabling sustainable item-level intelligence in trillions of devices over the next decade.

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