EV Group (EVG) today announced that it will highlight key advances in hybrid and fusion wafer bonding, infrared (IR) laser layer release technology, and lithography for advanced semiconductor and micro-electronics manufacturing and packaging at the SEMICON Taiwan 2024 expo in Taipei, Taiwan on September 4-6.
Packaging
New IBM Processor Innovations to Accelerate AI on Next-Generation IBM Z Mainframe Systems
IBM revealed architecture details for the upcoming IBM Telum II Processor and IBM Spyre Accelerator at Hot Chips 2024.
Everspin Awarded $14.55M to Provide Continued, Stable On-Shore MRAM Manufacturing
Under the award, Everspin will provide a plan to mitigate risks to its MRAM manufacturing supply chain.
Oxford Instruments Asylum Research Receives R&D 100 and Frost & Sullivan Awards for its Vero Atomic Force Microscope
Oxford Instruments Asylum Research announced today that its next-generation Atomic Force Microscope (AFM), Vero, has received three prestigious awards.
NSF Awards $38M to Strengthen Research Infrastructure
The U.S. National Science Foundation has awarded researchers in Maine, Mississippi, New Mexico, Puerto Rico and Rhode Island roughly $38 million through the Established Program to Stimulate Competitive Research (EPSCoR), which promotes the development of research competitiveness among 28 targeted states and territories, called jurisdictions.
Semiconductor Industry Experts to Present Solutions to Boost Performance at Advanced Packaging Summit in Korea
The Advanced Packaging Summit 2024 will gather industry visionaries on September 11 at the Suwon Convention Center to present packaging technology roadmaps and discuss solutions to performance challenges.
Fujitsu Semiconductor Memory Solution Announces Change in Its Name to RAMXEED LIMITED
Fujitsu Semiconductor Memory Solution Limited is pleased to announce that the company name will change to RAMXEED LIMITED, effective January 1, 2025.
Alpha and Omega Semiconductor Expands Surface Mount Package Offering with New LFPAK 5×6 Package
Alpha and Omega Semiconductor Limited, a designer, developer, and global supplier of a broad range of discrete power devices, wide band gap power devices, power management ICs, and modules, today announced its new highly robust power MOSFET LFPAK 5×6 package.
Pfeiffer Vacuum Achieves Gold Medal in EcoVadis Sustainability Ranking
Pfeiffer Vacuum, a member of the global Busch Group, has once again been awarded the prestigious EcoVadis Gold Medal for its site in Asslar.
Pfeiffer Vacuum Introduces New HiQuad Neo Mass Spectrometer
With its new HiQuad Neo mass spectrometer, Pfeiffer Vacuum combines powerful performance with flexibility and user-friendly operation.
