Years of budget constraints have left federal statistical agencies with insufficient resources to measure key elements of the U.S. economy.
Packaging
Micron to Sell Lehi, Utah, Fab to Texas Instruments
Micron Technology, Inc. announced today that it has entered into a definitive agreement to sell its Lehi, Utah, fab to Texas Instruments.
SEMICON Taiwan Postponed to December 2021 or January 2022
SEMICON Taiwan has been postponed from September 8-10 to December 2021 or January 2022 in response to a resurgence of COVID-19 cases in Taiwan, SEMI Taiwan announced today.
Synopsys Strategic Partnership with Samsung Foundry Accelerates Access to Transformative 3nm GAA Technology
This tapeout is the culmination of an extensive collaboration between Synopsys and Samsung Foundry to accelerate the delivery of a highly optimized reference methodology that realizes the maximum power and performance opportunities inherent to the latest 3D transistor architecture.
Novel Heat-Management Material Keeps Computers Running Cool
UCLA engineers have demonstrated successful integration of a novel semiconductor material into high-power computer chips to reduce heat on processors and improve their performance.
Rigetti Computing Introduces World’s First Scalable Multi-Chip Quantum Processor
Rigetti Computing, a pioneer in full-stack quantum computing, announced today it is launching the world’s first multi-chip quantum processor.
SIA Calls for House Passage of Legislation to Advance U.S. Technology Leadership
The National Science Foundation for the Future Act (H.R. 2225) and the Department of Energy Science for the Future Act (H.R. 3593) would help maintain and build on U.S. science and technology leadership.
Park Systems Announces Park FX40, the Autonomous AFM with Built-in Intelligence
Park Systems, the fastest growing manufacturer of Atomic Force Microscopes (AFM) just announced Park FX40, a groundbreaking autonomous atomic force microscope, infused with innovative robotics, intelligent learning features, safety features, software and specialized add-ons.
Presto Engineering and Cadence Collaborate on IC Packaging for Automotive and IoT Markets
Presto Engineering, an ASIC design and outsourced operations provider, and Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced a collaboration to broaden semiconductor package design solutions and expertise for high-performance system-in-package (SiP) development for the automotive and Industrial IoT markets.
A More Robust Memory Device for AI Systems
A research team from Northwestern Engineering and the University of Messina in Italy have developed a new magnetic memory device that could lead to faster, more robust Artificial Intelligence (AI) systems.
