Synopsys, Inc. today shared that several leading semiconductor companies have adopted its new PrimeSim Reliability Analysis solution that unifies production-proven, foundry-certified reliability analysis technologies for analog, mixed-signal and full-custom designs.
Packaging
MRSI Systems Announces Chinese Patent Issued Covering Die Placement Head with Turret
This patent covers an innovative design that utilizes a precision horizontal tool holding turret for rapid and in-process calibration-free tool changing.
GaN Systems Signs Semiconductor Capacity Agreement with BMW
GaN Systems today announced the signing of a comprehensive Capacity Agreement with BMW Group for GaN Systems’ high-performance, automotive-grade GaN power transistors, which increase the efficiency and power density of critical applications in electric vehicles.
Tower Semiconductor Announces Breakthrough LiDAR Technology for Advanced Driver-Assistance Systems
Tower Semiconductor, the foundry of high-value analog semiconductor solutions, today announced a breakthrough development of LiDAR IC technology designed for advanced driver-assistance systems (ADAS) and ultimately self-driving cars.
What’s in the August/September Issue?
Each issue of Semiconductor Digest has articles found only in the magazine! Read the August/September issue…
3Q21 Earnings Outlooks Bode Well for Most Leading Semi Suppliers
IC Insights’ recently released its compilation of third-quarter sales growth expectations for the top-25 semiconductor…
Cloud Energy Deploys Network Using LoRaWAN For Wireless Solar Power System Enabling Effective Energy Monitoring
Semtech Corporation, a supplier of high performance analog and mixed-signal semiconductors and advanced algorithms, announced its collaboration with Cloud Energy
Cadence and Samsung Accelerate 3nm Mixed-Signal Silicon
Cadence Design Systems, Inc. today announced that it has collaborated with Samsung Foundry to deliver qualified Mixed-Signal OpenAccess-ready process design kit (PDK) technology files that support a range of Samsung process technologies from 28FDS to GAA base 3nm.
Samsung Receives Its First Global Carbon Footprint Certification for Logic Chips
Samsung Electronics Co., Ltd. today announced that four of its System LSI products received product carbon footprint label certification from the Carbon Trust, the first of Samsung’s logic chips to do so.
Lam Research to Open New Semiconductor Equipment Manufacturing Facility in Oregon
Lam Research Corp. today announced the expansion of its manufacturing footprint in Oregon with a new 45,000 square foot facility in the city of Sherwood, planned to open in December 2021.
