Fully connected, data-driven, self-optimizing: in Dresden, Bosch is opening one of the world’s most modern wafer fabs.
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Texas Instruments Continues As World’s Top Analog IC Supplier
Skyworks Solutions posts strongest sales increase in 2020 as the top-10 suppliers collectively accounted for 62% of total analog sales.
The Biodegradable Battery
The fabrication device for the battery revolution looks quite unconspicuous: it is a modified, commercially available 3D printer, located in a room in the Empa laboratory building. But the real innovation lies within the recipe for the gelatinous inks this printer can dispense onto a surface.
IEEE International Electron Devices Meeting Announces 2021 Call for Papers
Under the theme “Devices for a New Era of Electronics: From 2D Materials to 3D Architectures,” the 67th annual IEEE International Electron Devices Meeting (IEDM) has issued a Call for Papers seeking the world’s best original work in all areas of microelectronics research and development.
Imec Joins Forces With Sivers Photonics and ASM AMICRA
imec, together with Sivers Photonics and ASM AMICRA Microtechnologies, announced the successful wafer-scale integration of indium-phosphide (InP) distributed feedback (DFB) lasers from Sivers’ InP100 platform onto imec’s silicon photonics platform (iSiPP).
Intel 144-Tier Three-deck FG NAND with 161 Total Gates
A new 3D QLC NAND product has just arrived. TechInsights has quickly reviewed the Intel 1Tb QLC die removed from SSD 670p series which use 144L 3D NAND devices.
Synopsys Expands Multi-Die Solution Leadership with Industry’s Lowest Latency Die-to-Die Controller IP
Synopsys, Inc. today announced its new DesignWare Die-to-Die Controller IP, which complements the company’s existing 112G USR/XSR PHY IP for a complete die-to-die IP solution.
Dominant Factor of Carrier Transport Mechanism in Multilayer Graphene Nanoribbons Revealed
Researchers precisely set the number of layers in multilayer graphene nanoribbons, controlling the semiconducting and metallic properties of field effect transistors and establishing a design guideline for the practical applications of graphene devices.
NXP Announces Two Processors on TSMC 16nm FinFET Technology
NXP Semiconductors N.V. and TSMC today announced the release of NXP’s S32G2 vehicle network processors and the S32R294 radar processor into volume production on TSMC’s advanced 16nm FinFET process technology.
Micron Unveils 176-Layer NAND and 1-Alpha DRAM
Volume ramp of memory and storage portfolio additions power innovation across data center, intelligent vehicles and consumer devices.
