Global semiconductor equipment billings increased 51% year-over-year and 21% from the prior quarter to US$23.6 billion, SEMI announced today in its Worldwide Semiconductor Equipment Market Statistics (WWSEMS) Report.
Packaging
TSMC Unveils Innovations at 2021 Online Technology Symposium
TSMC is unveiling its latest innovations in advanced logic technology, specialty technologies, and TSMC 3DFabric advanced packaging and chip stacking technologies at the Company’s 2021 Technology Symposium.
A*STAR’s Institute of Microelectronics and NexGen Announce New Wafer Applications Joint Laboratory in Singapore
A*STAR’s Institute of Microelectronics (IME) and NexGen Wafer Systems (NexGen) have established a S$9 million wafer applications joint laboratory to develop chemical wet etching and wafer substrate thinning processes for semiconductor IC fabrication and 3D wafer level packaging technology.
Microchip Further Protects FPGA-based Designs with First Tool that Combats Major Industry Threat to System Security in the Field
Mission-critical and other high-assurance systems deployed worldwide are under rapidly evolving threats from cybercriminals who attempt to extract Critical Program Information (CPI) via the FPGAs that power them.
Samsung’s New Mid-power LED Integrates Unsurpassed Light Efficacy with Outstanding Color Quality
Samsung Electronics Co. today introduced the LM301B EVO, a new mid-power LED package that has been designed to set the pace in light efficacy and color quality for indoor and industrial applications.
Renesas Expands Portfolio of World’s Smallest Photocouplers for Industrial Automation and Solar Inverter Applications
Renesas Electronics Corporation (TSE:6723), a supplier of advanced semiconductor solutions, today expanded its family of 8.2mm creepage photocouplers with three new devices designed for operation in harsh industrial automation equipment, solar inverter, and EV charger operating environments.
OmniVision Announces 0.61µm pixel, High Resolution 4K Image Sensor
OmniVision Technologies, Inc., a developer of advanced digital imaging solutions, today announced the OV60A―the world’s first 0.61 micron (µm) pixel high resolution CMOS image sensor that will revolutionize the capabilities of next-generation mobile phone cameras.
Global Organic CMOS Image Sensor Market is Expected to Grow at a CAGR of 12.2% from 2017 to 2028
The global Organic CMOS Image Sensor Market was valued at USD 1,086.7 million in 2020 and is projected to register a CAGR of 12.2% to reach USD 2,723.8 million by 2028 in the COVID-19 period.
Top-15 Semi Companies Log Year-Over-Year Growth of 21% in 1Q21
Excluding Intel, the group would have shown a 29% jump in 1Q21/1Q20 sales.
AI Chipmaker Hailo Awarded Edge AI and Vision Product of the Year
The Hailo-8, the AI processor for edge devices from AI (Artificial Intelligence) chipmaker Hailo, has been selected as winner of the 2021 Edge AI and Vision Product of the Year Awards for “Best Edge AI processor.”
