Pasternack’s new high-power RF and microwave PIN diode switches utilize GaN semiconductor technology.
Packaging
Xpeedic On-Chip Passive EM Simulation Suite Certified for Samsung Foundry 8LPP Process Technology
Xpeedic today announced that its on-chip passive EM simulation suite has been certified by Samsung Foundry for its advanced 8LPP (8nm Low Power Plus) process technology.
Reno Sub-Systems Launches GenMatch Series of Integrated RF Power Systems for Semiconductor Manufacturing at 7nm or Below
Reno Sub-Systems (Reno), a developer of high performance radio frequency (RF) matching networks for leading-edge nanoscale semiconductor manufacturing, today introduced its new GenMatch Series that integrates the company’s proven solid-state Electronic Variable Capacitor (EVC) RF match and Precis generator technologies into a single unit.
Kioxia Announces Expansion of Yokohama Technology Campus and New Research Center
Kioxia Corporation today announced a 20 billion yen investment to expand its Technology Development Building at its Yokohama Technology Campus and to establish its new Shin-Koyasu Advanced Research Center.
MasterGaN Reference Design from STMicroelectronics Demonstrates Heatsink-Free 250W Resonant Converter
STMicroelectronics has released the first reference design for its MasterGaN power packages, demonstrating how the new highly integrated devices increase power density, boost energy efficiency, simplify design, and accelerate time to market.
Intel and QuTech Demonstrate Advances in Solving Quantum Interconnect Bottlenecks
New research published in Nature highlights progress toward quantum scalability with high-fidelity control and programmability of silicon qubits using the Horse Ridge cryogenic controller.
AIM Photonics Announces Appointment of Tod A. Laursen as Chair of Leadership Council
The American Institute for Manufacturing Integrated Photonics (AIM Photonics) today announced the appointment of Dr. Tod A. Laursen, as Chair of the AIM Photonics Leadership Council, which focuses on the strategic and technical direction of the Institute.
Researchers Develop Magnetic Thin Film for Spin-Thermoelectric Energy Conversion
A team of researchers, affiliated with UNIST has recently introduced a new class of magnetic materials for spin caloritronics.
Samsung Unveils Industry-First Memory Module Incorporating New CXL Interconnect Standard
Samsung Electronics Co., Ltd. today unveiled the industry’s first memory module supporting the new Compute Express Link (CXL) interconnect standard.
Veeco Announces Multi-System Lithography Order
Veeco Instruments Inc. (NASDAQ: VECO) today announced that a world leader in semiconductor assembly and testing has placed a multi-system order for its AP300 Lithography System for the production ramp of advanced packaging chips.
