Pfeiffer Vacuum presents its new HiPace 80 Neo turbopump, which features a longer life before service and reduced vibration and noise emissions.
Packaging
New Material Offers Ecofriendly Solution to Converting Waste Heat into Energy
A team of scientists from Northwestern University and Seoul National University in Korea now has demonstrated a high-performing thermoelectric material in a practical form that can be used in device development.
Intel Accelerates Process and Packaging Innovations
Intel Corporation this week revealed one of the most detailed process and packaging technology roadmaps the company has ever provided, showcasing a series of foundational innovations that will power products through 2025 and beyond.
IC Insights Forecasts a 21% Surge in IC Unit Shipments This Year
A 21% jump would be the largest increase in IC unit shipments since the boom year of 2010.
Mobix Labs Introduces Ultra-Wideband mmWave 5G Beamformer
Mobix Labs Inc. today introduced its MBX10 True5G mmWave beamformer AIP (antenna-in-package) and its MIC600 single-chip, single-die beamformer IC (integrated circuit) that deliver ultra-wideband performance from 24.25 – 43.5 GHz.
Pfeiffer Vacuum Introduces New HiScroll ATEX Scroll Pump
The new pumps in the HiScroll ATEX range meet the requirements of the European directive 2014/34/EU.
Micron Launches World’s First 176-Layer NAND in Mobile Solutions
Micron Technology, Inc. announced today it has begun volume shipments of the world’s first 176-layer NAND Universal Flash Storage (UFS) 3.1 mobile solution.
Kyocera Celebrates 50 Years of U.S. Manufacturing
The City of San Diego has honored Kyocera International, Inc. for 50 years of U.S. manufacturing.
Mouser Receives Outstanding Partnership Award from Epson America
Epson presented Mouser’s Ben Venator and Melinda Harper with the award for continued increases in market share and customer count.
Winbond and Synopsys Deliver Complete High-Density NAND Flash Memory Solution
Winbond Electronics today announced the successful interoperability of Synopsys’ DesignWare Synchronous Serial Interface (SSI) IP and Winbond’s OctalNAND Flash Memory.
