Tomorrow’s cutting-edge technology will need electronics that can tolerate extreme conditions. That’s why a group of researchers led by Michigan State University’s Jason Nicholas is building stronger circuits today.
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JEDEC Wide Bandgap Power Semiconductor Committee Publishes a Milestone Document for Bias Temperature Instability of SiC MOS Devices
JEDEC Solid State Technology Association announces the publication of JEP184: Guideline for evaluating Bias Temperature Instability of Silicon Carbide Metal-Oxide-Semiconductor (MOS) Devices for Power Electronic Conversion.
SiFive and Samsung Foundry Extend Partnership to Accelerate AI SoC Development
The extended partnership will enable and accelerate the development of Artificial Intelligence and Machine Learning inference and training SoCs based on SiFive RISC-V processors and built using Samsung Foundry technology infrastructure.
Silicon Chip Will Drive Next Generation Communications
A new design of ultra-small silicon chip called a multiplexer will effectively manage terahertz waves which are key to the next generation of communications: 6G and beyond.
FormFactor, Inc. Reports 2021 First Quarter Results
FormFactor, Inc. today announced its financial results for the first quarter of fiscal 2021 ended March 27, 2021.
Fabless Suppliers Held a Record 33% of the 2020 IC Market
Fabless IC suppliers registered a strong 24% surge in sales last year as compared to only an 8% increase by the IDMs.
Semtech Unveils LoRa Corecell Reference Design for Full Duplex Gateway Applications
Semtech Corporation today announced the launch of a new product in its LoRa Core portfolio, the LoRa Corecell Reference Design for full duplex gateway applications in the U.S. 902 – 928MHz ISM band.
Automotive LiDAR Market Growth Sturdy at 30.4% CAGR to Outstrip $4,348.09 Million by 2027
The Automotive LiDAR Market Size was valued at US$ 521.35 million in 2019 and is projected to reach US$ 4,348.09 million by 2027; it is expected to grow at a CAGR of 30.4% during 2019–2027.
Silicon Integration Initiative Targets New Silicon Carbide Standard SPICE Model
The Si2 Compact Model Coalition has voted to fund and standardize a SPICE model for silicon carbide-based metal-on-silicon field-effect transistors.
Akoustis Announces Issuance of Nine New Patents
Akoustis Technologies, Inc. announced the issuance of nine new patents related to its innovative BAW resonators, piezoelectric materials, XBAW manufacturing process, wide-bandwidth RF filters and its applications in 5G mobile and other wireless devices.
