SK hynix Inc. announced today that it has developed the industry’s first 16Gb DDR5 built using its 1c node, the sixth generation of the 10nm process.
Packaging
HeterMM: Applying in-DRAM Index to Heterogeneous Memory-Based Key-Value Stores
Emerging byte-addressable storage technologies, such as NVM, provide a more cost-effective and larger-capacity alternative to DRAM, presenting new opportunities to address the high cost, limited capacity, and volatility of in-memory key-value (KV) stores.
Researchers Unveil Scalable Graphene Technology to Revolutionize Battery Safety and Performance
Researchers at Swansea University, in collaboration with Wuhan University of Technology, Shenzhen University, have developed a pioneering technique for producing large-scale graphene current collectors.
Keysight Unveils Wire Bond Inspection Solution for Semiconductor Manufacturing
Keysight Technologies, Inc. (NYSE: KEYS) introduces the Electrical Structural Tester (EST), a wire bond inspection solution for semiconductor manufacturing that ensures the integrity and reliability of electronic components.
Efficient and GlobalFoundries Partner to Enable a New Category of Ultra Energy-Efficient, High-Performance Processors
Today, Efficient announced a strategic partnership with GlobalFoundries (GF) to bring to market a new high-performance computer processor that is up to 166x more energy-efficient than industry-standard embedded CPUs.
Tech Industry Veteran Anders Storm Named Chief Executive Officer of Dirac Research AB
Thirty-year software, engineering, and semiconductor industry veteran brings deep technical knowledge and C-level executive management experience to Dirac.
Nordson Electronics Solutions to Feature High-Throughput Fluid Dispensing Technologies at SEMICON Taiwan 2024
Nordson Electronics Solutions will feature the latest technologies in fluid dispensing for semiconductor advanced packaging at the SEMICON Taiwan tradeshow, booth L0516.
Lita Shon-Roy, President/CEO of TECHCET Wins Gold Stevie Award in 2024 International Business Awards
Lita Shon-Roy, President and CEO of TECHCET, was named the winner of a Gold Stevie Award in the Thought Leader of The Year – Business Services category in The 21st Annual International Business Awards for her work as a Semiconductor Materials Supply Chain Thought Leader.
EV Group Highlights 3D Integration Process Solutions at SEMICON Taiwan 2024
EV Group (EVG) today announced that it will highlight key advances in hybrid and fusion wafer bonding, infrared (IR) laser layer release technology, and lithography for advanced semiconductor and micro-electronics manufacturing and packaging at the SEMICON Taiwan 2024 expo in Taipei, Taiwan on September 4-6.
New IBM Processor Innovations to Accelerate AI on Next-Generation IBM Z Mainframe Systems
IBM revealed architecture details for the upcoming IBM Telum II Processor and IBM Spyre Accelerator at Hot Chips 2024.
