YES has chosen the YES RapidCure polymer dielectric curing systems for their implementation of the M-Series fan-out wafer level packaging (FOWLP) technology in partnership with Deca Technologies ‘Deca’.
Packaging
Amkor Technology Names John Liu to Board of Directors
Amkor Technology, Inc., a provider of semiconductor packaging and test services, announced today that John Liu has been appointed as a new member of the company’s Board of Directors.
Working Group Named Targeting Billions in CHIPS and Science Act Funding for Washington State
Commerce Department announces first working group members to develop statewide response to historic federal funding opportunities, slates first meeting Dec. 17.
ROHM’s PMICs for SoCs Adopted in Reference Designs for Telechips’ Next-Generation Cockpits
Intended for use inside the cockpits of European automakers, these designs are scheduled for mass production in 2025.
Silicon Industry Veteran Oreste Donzella Joins Sondrel Board as Non-Executive Director
Sondrel, a provider of ultra-complex custom chips, has announced that industry veteran, Oreste Donzella will join its board as a Non-Executive Director (NED) on January 1, 2025.
IBM Brings the Speed of Light to the Generative AI Era with Optics Breakthrough
New co-packaged optics innovation could replace electrical interconnects in data centers to offer significant improvements in speed and energy efficiency for AI and other computing applications.
CEA-Leti Demonstrates Embedded FeRAM Platform Compatible with 22nm FD-SOI Node
CEA-Leti research engineers have demonstrated for the first time a scalable hafnia-zirconia-based ferroelectric capacitor platform integrated into the back-end-of-line (BEOL) at the 22nm FD-SOI technology node.
NY CREATES and JETRO Announce Strategic Partnership to Strengthen U.S.-Japan Collaboration in the Semiconductor Industry
NY CREATES and the Japan External Trade Organization (JETRO) today announced a strategic partnership to drive international collaboration in the semiconductor industry, highlighting a commitment to promoting advanced chips-related research and development, technology alliances, and workforce development across the high-tech ecosystems of New York’s Capital Region and Japan.
Destination 2D Brings Graphene to Mainstream CMOS
Destination 2D – a new semiconductor startup with unmatched expertise in graphene process technology – today announced it has successfully achieved wafer-scale synthesis of high-quality graphene within CMOS-compatible process conditions.
Global Semiconductor Alliance Announces the 2024 Recipients of the GSA Annual Awards
Last night, the Global Semiconductor Alliance (GSA) celebrated its 30th anniversary and the achievements of remarkable individuals and exceptional semiconductor companies at its annual GSA Awards Ceremony gala.
