Diraq announced it has successfully demonstrated consistent and repeatable operation with above 99% fidelity of two-qubit gates in the SiMOS (silicon metal-oxide-semiconductor) quantum dot platform.
Packaging
OKI Sets Up New PCB Manufacturing Line for Semiconductor Manufacturing and Testing Equipment at Joetsu Plant
The OKI Group PCB business company OKI Circuit Technology has set up a new ultra-high-multilayer PCB line at the Joetsu Plant in Joetsu City, Niigata Prefecture, with full-scale operations commencing in July.
2025 IEEE Electronic Components and Technology Conference Announces Call for Papers
The IEEE Electronic Components and Technology Conference (ECTC), the premier technical conference and product exhibition for the world’s semiconductor packaging industry, has announced a Call for Papers for ECTC 2025, the conference’s 75th anniversary.
Greene Tweed Highlights ONX 600 for Semiconductor Applications
This material provides peak durability, performance, and safety in critical environments.
Archer Sends New Biochip gFET Design for Manufacture to Bolster Functionality
Archer Materials Limited, a semiconductor company advancing the quantum technology and medical diagnostics industries, has sent a new graphene field effect transistor (gFET) design for its Biochip to VTT Technical Research Centre of Finland Ltd for manufacture 200mm diameter wafers via a MPW run for integration with CMOS readout.
Veeco Announces Agreement with IBM to Explore Wet Processing Systems for Advanced Packaging Applications
Veeco Instruments Inc. (NASDAQ: VECO) today announced that IBM selected the WaferStorm Wet Processing System for Advanced Packaging applications and has entered into a joint development agreement to explore advanced packaging applications using multiple wet processing technologies from Veeco.
IMAPS 57th International Symposium on Microelectronics Planned for September 30 – October 3, 2024, in Boston
The 57th International Symposium on Microelectronics (IMAPS 2024) will be held September 30 – October 3, 2024, at the Encore Boston Harbor in Boston, Massachusetts.
Tachyum Builds Last FPGA Prototypes Batch Ahead of Tape-Out
Tachyum today announced the final build of its Prodigy FPGA emulation system in advance of chip production and general availability next year.
Movellus Joins the Silicon Catalyst In-Kind Partner Ecosystem
Movellus today announced that it has joined the Silicon Catalyst ecosystem as the newest member of their In-Kind Partner (IKP) network.
Microchip and Acacia Collaborate to Enable Optimized Terabit-Scale Data Center Interconnect Systems
The companies enable an interoperable coherent optics ecosystem that can help streamline the development of data center interconnect and metro transport systems.
