The relocation expands operations and capabilities for SELECT’s selective soldering systems used in electronics manufacturing.
Packaging
KLA Launches New Portfolio of Automotive Products to Improve Chip Yield and Reliability
KLA Corporation announced the launch of four new products for automotive chip manufacturing: the 8935 high productivity patterned wafer inspection system, the C205 broadband plasma patterned wafer inspection system, the Surfscan SP A2/A3 unpatterned wafer inspection systems and I-PAT inline defect part average testing screening solution.
Kioxia’s AI Project Wins 2020 Field Innovation Award Silver Prize From Japanese Society for Artificial Intelligence
Kioxia Corporation announced today that it was awarded the 2020 Field Innovation Award Silver Prize by the Japanese Society for Artificial Intelligence (JSAI) for its TEZUKA 2020 project.
Park Systems Appoints Dr. Stefan Kaemmer as President, Park Systems Americas
“Park Systems is experiencing unprecedented expansion, and during the coming years we expect to add significantly to the revenue growth that put us at the One Trillion Mark at Kosdaq in 2021”, comments Dr. Sang-il Park, CEO & Founder of Park Systems.
Microchip Boosts GaN RF Portfolio with Ka-band Monolithic MMIC with High Linearity for SatCom Terminals
The new device, Microchip’s first GaN MMIC, is designed for use in commercial and defense satellite communications, 5G networks and other aerospace and defense systems.
STMicroelectronics Powers Wireless-Charging Growth with Secure Solution for Consumer and Automotive Qi-certified Chargers
STMicroelectronics (NYSE: STM) is protecting wireless charging of small devices and mobiles with a convenient solution for authenticating certified Qi chargers.
EV Group Launches Step-And-Repeat Mastering Services for Nanoimprint Lithography
EV Group announced that it has established the EVG Step-and-Repeat (S&R) Mastering Shop, a new service offering to help customers accelerate the deployment of nanoimprint lithography (NIL) in high-volume manufacturing.
Paving the Way for Smart Factories
Intel, EXOR International, TIM and JMA Wireless teamed together to build an end-to-end smart factory in Verona, Italy, as an example of the benefits of Industry 4.0 digitalization to manufacturers of all sizes.
ROHM Introduces Industry-first AC/DC Converter ICs in a Surface Mount Package with Built-in 1700V SiC MOSFET
ROHM Semiconductor today introduced the industry’s first AC/DC converter ICs with a built-in 1700V SiC MOSFET (BM2SC12xFP2-LBZ) in the TO263-7L package.
Winbond Unveils New 1.8V 512Mb SPI NOR flash for 5G and Other High-End Server Applications
Winbond Electronics Corporation, a global supplier of semiconductor memory solutions, today announced it is expanding its total solution of SPI NOR Flash with the introduction of the new single die monolithic 1.8V 512Mb SPI NOR flash.
