Packaging

IAR Systems Appoints Kazuhisa Harabe as New Country Manager for Japan

IAR Systems, a supplier of software tools and services for embedded development, today announced that Kazuhisa Harabe has been appointed to Country Manager for IAR Systems Japan.

Toppan Photomasks Receives Supplier Excellence Award from Texas Instruments

Toppan Photomasks, Inc. announced today that it has received the 2020 Supplier Excellence Award from Texas Instruments (TI).

Semiconductor Units Forecast To Exceed 1 Trillion Devices Again in 2021

A 13% increase is expected to lift total semiconductor shipments to a new record high.

Semtech Expands Industry’s Most Comprehensive 5G Wireless Front Haul Portfolio With its Latest 50Gbps Tri-Edge CDR IC Solution

GN2256 is a bidirectional Tri-Edge CDR with integrated differential EML driver for 50Gbps SFP56 PAM4 5G wireless optical modules

ASE Wins Sustainability Award

Advanced Semiconductor Engineering, Inc. (ASE) announced today that it has received the 3D InCites 2021 Sustainability Award.

SEMI Provides U.S. Commerce Department with Analysis of Semiconductor Supply Chain Risks

SEMI today announced that it filed comments with the U.S. Department of Commerce in response to its request for public comments regarding risks in the semiconductor manufacturing and advanced packaging supply chain.

ISS Europe to Explore Digitalization, Security and Environmental Sustainability

Leading executives, analysts, economists and technologists will gather 20-22 April, 2021, at the SEMI Industry Strategy Symposium Europe (ISS Europe), a virtual event, to highlight the technologies and the collaborations vital to meeting Europe’s most pressing strategic, social and economic challenges. Registration is open.

OpenFive Launches Die-to-Die Interface Solution for Chiplet Ecosystem

OpenFive announced the launch of a Die-to-Die (D2D) PHY that complements the company’s existing D2D Controller to offer complete D2D interface solutions for various packages including substrates and interposers.

Lattice Brings Embedded Vision Optimized FPGA to Automotive Applications

Lattice Semiconductor Corporation today expanded its award-winning Lattice Crosslink-NX family with new FPGAs specified for automotive applications such as advanced driver assistance systems (ADAS) and in-vehicle infotainment (IVI) systems.

SEMI Applauds Initiatives to Bolster Semiconductor Manufacturing and Research in American Jobs Plan

SEMI today applauded the inclusion of initiatives to strengthen U.S. semiconductor manufacturing and research and calls for investment in the Biden Administration’s American Jobs Plan.

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