GlobalFoundries (GF) today announced Elissa Murphy is joining the company’s board of directors with immediate effect as an independent director.
Packaging
Palomar Technologies new 3880-II Die Bonder Maximizes Productivity from R&D to Volume, Automated Bonding
Palomar Technologies today announced the availability of their new Palomar 3880-II Die Bonder.
Pfeiffer Vacuum Presents a Cloud-Based Solution for Service Management
Pfeiffer Vacuum’s new “Virtual Service Management” (VSM) is a free web app that makes it possible to manage vacuum equipment from different manufacturers.
Edwards Opens Lab at Hillsboro Innovation Center to Nurture Collaborative Solutions for Critical Industry Challenges
Edwards, a supplier of vacuum and abatement equipment to the semiconductor manufacturing industry, has opened a chemical laboratory at its Innovation Center in Hillsboro, OR.
Global Fab Equipment Spending Projected to Reach New High of Nearly $100 Billion in 2022, SEMI Reports
Powered by digital transformation and other secular technology trends, global semiconductor equipment investments for front end fabs in 2022 are expected to reach nearly US$100 billion to meet soaring demand for electronics after topping a projected $90 billion this year, both new records, SEMI highlighted today in its World Fab Forecast report.
Synopsys PrimeSim Reliability Analysis Solution Accelerates Design of Hyper-Convergent ICs for Mission-Critical Applications
Synopsys, Inc. today shared that several leading semiconductor companies have adopted its new PrimeSim Reliability Analysis solution that unifies production-proven, foundry-certified reliability analysis technologies for analog, mixed-signal and full-custom designs.
MRSI Systems Announces Chinese Patent Issued Covering Die Placement Head with Turret
This patent covers an innovative design that utilizes a precision horizontal tool holding turret for rapid and in-process calibration-free tool changing.
GaN Systems Signs Semiconductor Capacity Agreement with BMW
GaN Systems today announced the signing of a comprehensive Capacity Agreement with BMW Group for GaN Systems’ high-performance, automotive-grade GaN power transistors, which increase the efficiency and power density of critical applications in electric vehicles.
Tower Semiconductor Announces Breakthrough LiDAR Technology for Advanced Driver-Assistance Systems
Tower Semiconductor, the foundry of high-value analog semiconductor solutions, today announced a breakthrough development of LiDAR IC technology designed for advanced driver-assistance systems (ADAS) and ultimately self-driving cars.
What’s in the August/September Issue?
Each issue of Semiconductor Digest has articles found only in the magazine! Read the August/September issue…
