SiFive, Inc., the provider of commercial RISC-V processor IP and custom silicon solutions, today announced an open licensing agreement with the U.S. Defense Advanced Research Projects Agency (DARPA) to accelerate technology innovation as part of the DARPA Toolbox Initiative.
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CyberOptics to Share Technical Presentation About Airborne Particle Sensing Processes at PhotoMask Japan
CyberOptics Corporation will present a technical paper at PhotoMask Japan on April 20th at 6 p.m. CDT / April 21st at 8 a.m. JST.
Damage from Fire at Renesas Chip Factory Worse Than Initial Reports
Renesas Electronics Corporation today held a second press conference regarding the occurrence of a fire on March 19, 2021 at part of the processes in the N3 Building (300mm line) of Naka Factory (located in Hitachinaka, Ibaraki Prefecture).
Tortuga Logic and DARPA Extend Partnership Through the DARPA Toolbox Initiative
Tortuga Logic Inc. today announced a new licensing agreement with the U.S. Defense Advanced Research Projects Agency (DARPA) to accelerate technology innovation for DARPA programs.
Tachyum Releases Motherboard Emulation for Its Prodigy Processor FPGA Prototype to Manufacturing
Tachyum Inc. today sent the motherboard emulation prototype of its Prodigy Universal Processor FPGA prototype to manufacturing, which, when returned, will be plugged into its recently completed field-programmable gate array (FPGA) emulation Prodigy Processor boards to create a fully functional system, bringing Prodigy one step closer to delivery later this year.
New Drivers Propelling Semis, Equipment, IP
The shortage of semiconductors won’t be easy to solve, with some equipment lead times stretching out several years, said VLSI Research CEO Dan Hutcheson at a SEMI event.
Magnachip Enters into Definitive Agreement with Wise Road Capital in a Take Private Transaction Valued at $1.4 Billion
Magnachip Semiconductor Corporation, the South Korean leader in display and power solutions, today announced that it has entered into a definitive agreement with South Dearborn Limited, a company incorporated in the Cayman Islands, and Michigan Merger Sub, Inc., a Delaware corporation, which are investment vehicles established by Wise Road Capital LTD and certain of its limited partners.
SME Announces Geoffrey Boothroyd Outstanding Young Manufacturing Engineers
The 14 awardees, age 35 or younger, are being recognized for their exceptional contributions and accomplishments in manufacturing throughout the early stages of their careers.
TopLine Awarded US Patent for CCGA Lead Free Solder Columns
TopLine Corporation, a provider of electronic components, services, and component engineering technology, has been granted US patent 10,937,752 for Lead Free Solder Columns for Column Grid Array Substrates.
Samsung Develops Industry’s First HKMG-Based DDR5 Memory; Ideal for Bandwidth-Intensive Advanced Computing Applications
Samsung Electronics Co. today announced that it has expanded its DDR5 DRAM memory portfolio with the industry’s first 512GB DDR5 module based on High-K Metal Gate (HKMG) process technology.
