Bipartisan legislation would repeal a harmful tax provision that would make it more expensive for companies to perform R&D in the U.S.
Packaging
Highly Integrated, Galvanically Isolated Sigma-Delta Modulators from STMicroelectronics Boost Accuracy and Reliability
The STMicroelectronics ISOSD61 and ISOSD61L are high-accuracy isolated, second-order sigma-delta modulators that deliver enhanced performance and reliability in industrial applications such as motor control, electric-vehicle charging stations, solar inverters, UPS, and server and telecom power supplies.
Busch Vacuum Solutions Launches Vacuum Pump Service Program
Busch Vacuum Solutions USA, one of the largest manufacturers of vacuum pumps, blowers, compressors, and systems, announced the launch of their new Exchange PLUS vacuum pump service program.
Flex Logix Raises $55M Series D Financing as It Accelerates Market Adoption of AI Inference and EFPGA Solutions
Flex Logix Technologies, Inc. announced today the close of a $55 million oversubscribed Series D funding round.
Global Semiconductor Materials Market Sets New High of $55.3 Billion With 5% Expansion in 2020, SEMI Reports
The global semiconductor materials market grew 4.9% in 2020 to $55.3 billion in revenue, surpassing the previous market high of $52.9 billion set in 2018, SEMI, the global industry association representing the electronics manufacturing and design supply chain, reported today in its Materials Market Data Subscription (MMDS).
Investment Needed in US$500M Sulfuric Market
IC fabs “life blood” may soon be in short supply in US.
Nordson Electronics Solutions to Showcase Printed Circuit Board Assembly and Semiconductor Packaging Equipment at Productronica China and SEMICON China Tradeshows
Nordson Electronics Solutions are pleased to announce they will showcase many new dispensing, conformal coating, selective soldering, and surface treatment products and technologies at two events: Productronica China (Hall E6 booth #6202) and SEMICON China (Hall N4, booth #4022), both held at the Shanghai New International Expo Centre, Shanghai, China, March 17 – 20, 2021.
Deca Collaborates With ASE and Siemens to Launch APDK Design Methodology
Deca announced the introduction of its new APDK (Adaptive Patterning Design Kit) methodology. The solution is the result of Deca’s collaboration with Advanced Semiconductor Engineering, Inc. (ASE) and Siemens Digital Industries Software.
Integrated Passive Devices Market is Projected to Reach USD 2 Billion by 2026
According to a recent study from market research firm Global Market Insights, The integrated passive devices market growth shall be fostered by the numerous features offered by IPDs system such as reduced interconnection complexity, improved performance, reduced package footprints, improved component tolerance and output, and better flexibility.
Monozukuri Joins ESD Alliance
Monozukuri Technologies, the first EDA company to market a proven IC/package co-design tool, today became the newest member of the Electronic System Design Alliance, a SEMI Technology Community.
