X-NAND architecture enables NAND flash memory with lower cost and higher performance.
Packaging
Robust Growth Rates Expected For Nearly All IC Products in 2021
Special Purpose Logic, DRAM, Cellphone MPUs, and Display Drivers forecast to lead industry-wide upturn as demand extends into the second half of the year.
Keysight Launches Scienlab Battery Pack Test System with High Voltage Silicon Carbide Technology
Next generation test system delivers greater power in less space.
Journey to SEMICON Taiwan 2021 Kicks Off in September With Five Online Forums Covering Key Semiconductor Industry Themes
The journey to SEMICON Taiwan 2021 begins in September with five live online forums featuring expert insights into critical semiconductor industry areas – Power and Opto chips, Smart Manufacturing, Sustainable Manufacturing, Smart Medtech and Cybersecurity.
FPGA Market Worth $9.1 Billion by 2026
Increase in global adoption of AI and IoT, and rising deployment of data centers and high-performance computing are among the factors driving the growth of the FPGA market.
Pfeiffer Vacuum Introduces the Reliable and Low-Vibration HiPace 80 Neo Turbopump
Pfeiffer Vacuum presents its new HiPace 80 Neo turbopump, which features a longer life before service and reduced vibration and noise emissions.
New Material Offers Ecofriendly Solution to Converting Waste Heat into Energy
A team of scientists from Northwestern University and Seoul National University in Korea now has demonstrated a high-performing thermoelectric material in a practical form that can be used in device development.
Intel Accelerates Process and Packaging Innovations
Intel Corporation this week revealed one of the most detailed process and packaging technology roadmaps the company has ever provided, showcasing a series of foundational innovations that will power products through 2025 and beyond.
IC Insights Forecasts a 21% Surge in IC Unit Shipments This Year
A 21% jump would be the largest increase in IC unit shipments since the boom year of 2010.
Mobix Labs Introduces Ultra-Wideband mmWave 5G Beamformer
Mobix Labs Inc. today introduced its MBX10 True5G mmWave beamformer AIP (antenna-in-package) and its MIC600 single-chip, single-die beamformer IC (integrated circuit) that deliver ultra-wideband performance from 24.25 – 43.5 GHz.
