The new pumps in the HiScroll ATEX range meet the requirements of the European directive 2014/34/EU.
Packaging
Micron Launches World’s First 176-Layer NAND in Mobile Solutions
Micron Technology, Inc. announced today it has begun volume shipments of the world’s first 176-layer NAND Universal Flash Storage (UFS) 3.1 mobile solution.
Kyocera Celebrates 50 Years of U.S. Manufacturing
The City of San Diego has honored Kyocera International, Inc. for 50 years of U.S. manufacturing.
Mouser Receives Outstanding Partnership Award from Epson America
Epson presented Mouser’s Ben Venator and Melinda Harper with the award for continued increases in market share and customer count.
Winbond and Synopsys Deliver Complete High-Density NAND Flash Memory Solution
Winbond Electronics today announced the successful interoperability of Synopsys’ DesignWare Synchronous Serial Interface (SSI) IP and Winbond’s OctalNAND Flash Memory.
Coalition Calls on Congress to Invest in Domestic Semiconductor Manufacturing, Research, Design
The SIA – along with a broad coalition of 19 other tech, auto, medical, defense, and other business and labor groups – today in a letter urged Congress to enact funding for the semiconductor manufacturing, research, and design initiatives
Plasma-Therm ‘RANKED 1st’ in VLSI 2021 Survey for Etch & Clean Equipment
Plasma-Therm has once again been named the top supplier of etch and clean equipment for semiconductor manufacturing, according to the results of the 2021 VLSIresearch Customer Satisfaction Survey of worldwide semiconductor industry customers.
Intel Elects Andrea Goldsmith to Board of Directors
Intel Corporation today announced that Andrea Goldsmith, dean of engineering and applied science and professor of electrical and computer engineering at Princeton University, was elected to Intel’s board of directors, effective Sept. 1, 2021.
Phononic Raises $50 Million Growth Financing from Goldman Sachs Asset Management
To support the global demand for Sustainable innovations that address climate change, Phononic, a developer of solid-state cooling and heating technology, today announced that it has secured a significant growth investment led by $50 million from the Sustainable Investing business within Goldman Sachs Asset Management (Goldman Sachs).
TESCAN Launches Next Generation AutoSlicer Module for High Throughput TEM Sample Preparation
TESCAN ORSAY HOLDING a.s. announces its latest generation AutoSlicer module for unattended, semi-automated transmission electron microscope (TEM) lamella preparation in semiconductor failure analysis and materials science.
