ULVAC, Inc. has started accepting orders for the ENTRON-EXX, a new multi-chamber deposition system for semiconductor applications.
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SEMI Publishes Recommendations for Semiconductor Policies in the 2024-2029 European Commission Legislative Term
SEMI, the industry association serving the global electronics design and manufacturing supply chain, today published recommendations for the European Union to bolster its semiconductor ecosystem.
Hitachi High-Tech Launches DCR Etch System 9060 Series, Supporting Isotropic Etching of Advanced 3D Devices at the Atomic Level
Hitachi High-Tech Corporation announced today the launch of its DCR Etch System 9060Series.
Jean-Marc Chery, President & CEO, STMicroelectronics Named New GSA Board of Directors Chair
The Global Semiconductor Alliance (GSA) Board of Directors welcomes our new appointed Chair, Jean-Marc Chery, President & CEO, STMicroelectronics.
Morse Micro Appoints Yoshikazu Oishi as VP
Morse Micro announced the appointment of Yoshikazu Oishi as VP, Country Manager for Japan, effective immediately.
ROHM Semiconductor and Valeo Co-Develop the Next Generation of Power Electronics
ROHM Semiconductor and Valeo, an automotive technology company, today announced they are collaborating to propose and optimize the next generation of power modules for electric motor inverters using their combined expertise in power electronics management.
Biden-Harris Administration Announces CHIPS Incentives Award with Intel
Today, the Biden-Harris Administration announced that the U.S. Department of Commerce awarded Intel Corporation up to $7.865 billion in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.
Cerebras Appoints Tom Lantzsch to Board of Directors
Cerebras Systems today announced the appointment of Thomas (Tom) Lantzsch as a new independent board member.
POET Expands Capacity to Meet AI Infrastructure Demand
POET Technologies Inc. today announced its intention to expand its optical engine production capacity in Malaysia.
SK hynix Starts Mass Production of World’s First 321-High NAND
SK hynix Inc. announced today that it has started mass production of the world’s first triple level cell-based 321-high 4D NAND Flash with 1Tb capacity.
