The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer applauding semiconductor manufacturing incentives announced by the U.S. Commerce Department and SK hynix.
Packaging
Akoustis Announces Leadership Transition
Akoustis Technologies, Inc. announced today the mutually agreed resignation of Jeffery B. Shealy as Chief Executive Officer and as a member of the Board of Directors, effective August 6, 2024.
ACM Research Strengthens its Fan-Out Panel Level Packaging Portfolio with Launch of Ultra ECP ap-p Tool
ACM Research, Inc., a supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging applications, today announced its new Panel Electrochemical Plating (Ultra ECP ap-p) tool designed for fan-out panel-level packaging (FOPLP).
New Substrate Material for Flexible Electronics Could Help Combat E-Waste
Electronic waste is a rapidly growing problem, but this degradable material could allow the recycling of parts from many single-use and wearable devices.
New SEMI Foundation and Policy Equity Group Collaboration Earns Funding to Address Semiconductor Industry Child Care Gaps
Seeking to bolster the semiconductor industry workforce in the U.S. by addressing gaps in child care needs, the SEMI Foundation and Policy Equity Group today announced a collaboration to help companies comply with child care requirements under the U.S. CHIPS and Science Act.
U.S. Department of Commerce Announces Funds to SK hynix’s AI Memory Chip Facility
The preliminary memorandum of terms between the South Korean semiconductor manufacturer and the U.S. Department of Commerce will support high-bandwidth-memory AI chip production and advanced packaging R&D.
NEO Semiconductor Announces the Development of its 3D X-AI Chip
NEO Semiconductor, a developer of innovative technologies for 3D NAND flash memory and 3D DRAM, announced today the development of its 3D X-AI chip technology, targeted to replace the current DRAM chips inside high bandwidth memory (HBM) to solve data bus bottlenecks by enabling AI processing in 3D DRAM.
Global Semiconductor Sales Increase 18.3% in Q2 2024 Compared to Q2 2023
The Semiconductor Industry Association (SIA) today announced global semiconductor industry sales totaled $149.9 billion during the second quarter of 2024, an increase of 18.3% compared to the second quarter of 2023 and 6.5% more than the first quarter of 2024.
Micron Develops Industry’s First PCIe Gen6 Data Center SSD for Ecosystem Enablement
Micron Technology, Inc. today announced it is the first to develop PCIe Gen6 data center SSD technology for ecosystem enablement as part of a portfolio of memory and storage products to support the broad demand for AI.
M31 Collaborates With Tower Semiconductor
M31 Technology Corporation announced a collaboration with Tower Semiconductor yielding the successful development of static random access memory (SRAM) and read-only memory (ROM) IP products using a 65nm process.
