Total Telecom reports that China is steadily moving towards achieving its goal of mass-producing 14nm chips next year.
Packaging
Integra Technologies Launches Industry First 100V RF GaN/SiC Technology for Mission-Critical Defense Applications
Integra’s first 100V RF GaN product, the IGN1011S3600, delivers breakthrough output power performance of 3.6 kiloWatts at 70% efficiency for next generation avionic systems.
CAES Expands Apprentice Offerings to Silicon Valley
CAES, a provider of mission critical electronic solutions, is excited to announce that it has established an apprenticeship program in San Jose, California to further enhance Silicon Valley’s manufacturing workforce and to secure a highly skilled pipeline for technical talent.
Mouser Named e-Catalog Distributor of the Year by Molex for Americas, Asia and Europe
Mouser Electronics, Inc., the authorized global distributor with the newest semiconductors and electronic components, announced that it has received 2020 Americas e-Catalog Distributor of the Year, APS e-Catalog Distributor of the Year, and European e-Catalog Distributor of the Year honors from Molex.
Mid-Year Forecasts to Provide Global Chip Industry Insights
Annual mid-year semiconductor equipment, materials, fab capacity and economic forecasts will provide timely insights.
3D Stacking Paves Way for Smaller, Power-Packed Computing Chips
Scientists from the Institute of Microelectronics (IME) at the Agency for Science, Technology and Research (A*STAR) have developed breakthrough technology that can stack up to four layers of wafers, potentially decreasing the cost of production by 50 per cent.
A*STAR’s Institute of Microelectronics Teams with Major Industry Players in High Density System-in-Package Consortium for Heterogenous Chiplets Integration
The newly formed consortium will leverage IME’s expertise in FOWLP/2.5D/3D packaging.
Winbond HyperRAM & SpiStack and Renesas RZ/A2M Accelerate the Construction of Embedded AI Systems
Winbond Electronics Corporation, a global supplier of semiconductor memory solutions, announced today the official confirmation that its HyperRAM and SpiStack (NOR+NAND) can be operated with Renesas’ RZ/A2M Arm-based microprocessors (MPUs).
Rambus Completes Acquisition of AnalogX
Rambus Inc., a provider of chips and silicon IP making data faster and safer, today announced the completion of the acquisition of AnalogX.
Brooks Instrument Celebrates 75 Years of Innovation in Fluid Measurement and Control
Brooks Instrument is celebrating its 75th year providing high-precision fluid measurement and control instrumentation.
