Foundries and memory IC suppliers maintain strongest capacity presence.
Packaging
Kuprion Introduces ActiveCopper Filled Thermal Vias
Kuprion, Inc., a spinout of Lockheed Martin, introduced ActiveCopper™ Filled Thermal Vias, leveraging a patented technology breakthrough that addresses the increased reliability demands of heat and power dissipation for complex, advanced high performance systems.
Sensata Technologies Signs Definitive Agreement to Acquire Xirgo Technologies
Sensata Technologies (NYSE: ST), a leading industrial technology company and provider of sensor-rich solutions that create insight for customers, today announced the acquisition of leading telematics and data insight provider, Xirgo Technologies Intermediate Holdings, LLC (“Xirgo”) for $400 million, or approximately 16.0x 2021 EBITDA. Xirgo’s annual revenue is expected to exceed $100 million in 2021 with projected revenue growth in excess of 20% over the next several years. The transaction…
CHIPS Alliance Brings on Rob Mains as New Executive Director
CHIPS Alliance, the leading consortium advancing common and open hardware for interfaces, processors and systems, today announced the appointment of Rob Mains as the organization’s new executive director. Rob has over 35 years of experience in software engineering and development, with 25 years of experience as an EDA software architect focused on microprocessor design and advanced process node technologies. He most recently served as a technology advisor at Spillbox, and…
A*STAR’s Institute of Microelectronics Partners Eight Semiconductor Companies in Chip-to-Wafer Hybrid Bonding Consortium
A*STAR’s Institute of Microelectronics (IME) has partnered leading semiconductor companies to develop Chip-to-Wafer (C2W) Hybrid Bonding for high density 2.5D and 3D integrated circuit (IC) integration. The newly formed pre-competitive C2W Hybrid Bonding Consortium with international and local industry supply chain companies will leverage IME’s expertise in 2.5D and 3D IC integration and bonding technologies for the development of C2W hybrid bonding process and demonstration of 4 chips stacking with…
USABC Awards $732,448 Battery Technology Assessment Program Contract to Nanoramic Laboratories
The United States Advanced Battery Consortium LLC (USABC), a subsidiary of the United States Council for Automotive Research LLC (USCAR), today announced the award of a $732,448 technology assessment program contract to Nanoramic Laboratories in Boston, Massachusetts to demonstrate Nanoramic’s high energy and power density lithium-ion battery based on polymer binder-free electrode technology in electric vehicle (EV) applications. The contract award, which includes a 50 percent cost share, funds a…
Mouser Stocks Industry’s Widest Selection of Products
Mouser Electronics, Inc. is the industry’s leading authorized New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components.
ASM Pacific Technology and EV Group Join Forces to Enable Industry’s First Ultra Precision Die-to-Wafer Hybrid Bonding Solutions for 3D-IC Heterogeneous Integration
ASM PACIFIC TECHNOLOGY (ASM) and EV GROUP (EVG) announced the signing of a joint development agreement (JDA) to co-develop die-to-wafer hybrid bonding solutions for 3D-IC/heterogeneous integration applications.
Renesas and Dialog Semiconductor to Join Forces to Advance Global Leadership in Embedded Solutions
Renesas Electronics Corporation and Dialog Semiconductor Plc announced they have reached an agreement on the terms of a recommended all-cash acquisition by Renesas of the entire issued and to be issued share capital of Dialog (the “Acquisition”) for EUR 67.50 per share, representing a total equity value of approximately EUR 4.9 billion (approximately 615.7 billion yen).
Total MPU Sales Surprise with Strong Gains in 2020, More Upside in 2021
IC Insights recently released its 2021 edition of The McClean Report. The new analysis and forecast of the IC industry includes an analysis and forecast of the total microprocessor (MPU) market, including computer CPUs for PCs, tablets, and servers, embedded MPUs, and cellphone application MPUs.
