300mm fab investments in 2020 will grow by 13% year-over-year (YoY) to eclipse the previous record high set in 2018 and log another banner year for the semiconductor industry in 2023, SEMI reported today in its 300mm Fab Outlook to 2024.
Packaging
SEMICON Japan 2020 Goes Virtual to Highlight Electronics Innovations Powering a Smarter World
The promise of growing prosperity worldwide through digital transformation and smart technology innovations will take center stage at SEMICON Japan 2020 Virtual, December 11-18, as industry leaders and visionaries gather for the latest technologies, developments and trends across the electronics manufacturing and design supply chain.
Synopsys and Samsung Release Certified 3nm Gate-All-Around AMS Design Reference Flow for Early Design Starts
Synopsys, Inc. announced the release of the 3-nanometer (nm) gate-all-around (GAA) AMS Design Reference Flow, which provides designers a complete front-to-back design methodology for designing analog and mixed-signal circuits using the Synopsys Custom Design Platform.
Silicon Wafer Shipments Slip in Third Quarter 2020 but Strong for Year
Worldwide silicon wafer area shipments contracted 0.5% to 3,135 million square inches in the third quarter of 2020 compared to the second quarter of the year but registered a 6.9% increase from the 2,932 million square inches shipped one year ago during the same quarter.
CEA-Leti Announces Collaboration with Intel to Advance Chip Design Through Cutting-Edge 3D Packaging Technologies
CEA-Leti today announced a new collaboration with Intel on advanced 3D and packaging technologies for processors to advance chip design.
Transphorm Releases Latest High Voltage GaN Reliability Data
Transphorm, Inc. (OTCQB: TGAN)—a pioneer in and global supplier of high reliability, high performance gallium nitride (GaN) power conversion products—today released updated information regarding its GaN technology’s quality and reliability (Q+R).
Kioxia Corporation to Expand 3D Flash Memory Production Capacity by Building New Fabrication Facility at Yokkaichi Plant
Kioxia Corporation today announced it will begin construction of a fabrication facility (Fab7) at Yokkaichi Plant in Mie Prefecture, Japan to expand production of its proprietary 3D Flash memory BiCS FLASH.
Ansys Multiphysics Solutions Certified for Samsung Foundry’s Entire Line of FinFET Process Technologies
Ansys achieved new certifications of its leading-edge suite of semiconductor design solutions for all Samsung Foundry FinFET process nodes.
Synopsys and Samsung Foundry Collaboration Delivers Portfolio of Optimized iPDKs and Methodologies for Advanced Custom Design
Synopsys, Inc. today announced that in collaboration with Samsung Foundry, more than 30 new interoperable process design kits (iPDKs) have been jointly developed, validated and support the Synopsys Custom Design Platform.
Aldec’s TySOM Family of Embedded System Development Solutions Now Supports Xilinx PYNQ (Python Productivity for Zynq)
Aldec, Inc., a pioneer in mixed HDL language simulation and hardware-assisted verification for FPGA and ASIC designs, has added PYNQ Python Productivity for Zynq from Xilinx, Inc. to its TySOM family of Xilinx Zynq SoC based boards and its TySOM Embedded Development Kit.
