Teledyne Technologies Incorporated and FLIR Systems, Inc. jointly announced today that they have entered into a definitive agreement under which Teledyne will acquire FLIR in a cash and stock transaction valued at approximately $8.0 billion.
Packaging
What to Expect from the IC Industry in 2021
The year 2020 was a most unusual and challenging year for businesses and consumers.
Electronics and Photonics Innovation Center (EPIC) Purchases Palomar 3880 Die Bonder for Expanded Packaging Research
Palomar Technologies announced today that Electronics and Photonics Innovation Center (EPIC) has purchased a fully loaded 3880 Die Bonder.
Secure-IC Announces the Availability of its Protection Technologies in the Cloud
Secure-IC announces today the availability of its protection technologies (“Silicon Intellectual Property” – IPs) in the Cloud.
Semtech and AWS Collaborate on AWS IoT Core for LoRaWAN
Semtech Corporation announced that they have teamed up with Amazon Web Services (AWS) to integrate the LoRaWAN protocol on the Network Server with AWS IoT Core, AWS’s managed Cloud service that lets connected devices easily and securely interact with Cloud applications and other devices.
IAR Systems Enables Linux-Based Continuous Integration and Automated Workflows for RISC-V
IAR Systems, the future-proof supplier of software tools and services for embedded development, releases an update of its RISC-V build tools supporting implementation in Linux-based frameworks for automated application build and test processes.
Onto Innovation Announces First Customer Qualification of New Aspect IRCD System
Onto Innovation Inc. today announced the first customer acceptance and purchase of its new product, the Aspect System, at one of the top three memory manufacturers of leading-edge 3D-NAND devices.
CEA-Leti Scientists Present In-Memory Computing Pathways for Edge-AI & Neural Networks with 3D Architectures & Resistive-RAM
CEA-Leti presented two papers this week at IEDM 2020 that confirm the advantages of combining 3D architectures and resistive-random-access-memories (RRAM) for in-memory computing (IMC), and their applications for Edge-AI and neural networks.
SUEZ Unveils New Sievers TOC Analyzers for Online Ultrapure Water Monitoring
SUEZ – Water Technologies & Solutions announced the launch of two new Total Organic Carbon (TOC) online analyzers, the M500 for life sciences and the M500e for microelectronics markets.
Verific and DARPA Sign Partnership for Streamlined Access to Industry-Standard SystemVerilog EDA Software
Verific Design Automation today announced a partnership agreement with the U.S. Defense Advanced Research Projects Agency (DARPA) to provide the DARPA community access to its electronic design automation (EDA) software in production and development use throughout the semiconductor industry.
