Deca announced the introduction of its new APDK (Adaptive Patterning Design Kit) methodology. The solution is the result of Deca’s collaboration with Advanced Semiconductor Engineering, Inc. (ASE) and Siemens Digital Industries Software.
Packaging
Integrated Passive Devices Market is Projected to Reach USD 2 Billion by 2026
According to a recent study from market research firm Global Market Insights, The integrated passive devices market growth shall be fostered by the numerous features offered by IPDs system such as reduced interconnection complexity, improved performance, reduced package footprints, improved component tolerance and output, and better flexibility.
Monozukuri Joins ESD Alliance
Monozukuri Technologies, the first EDA company to market a proven IC/package co-design tool, today became the newest member of the Electronic System Design Alliance, a SEMI Technology Community.
GaN Systems Introduces the Industry’s Smallest and Smartest 100W GaN Charger Reference Design
GaN Systems announced today the release of the industry’s smallest 100W dual USB-C intelligent PD GaN charger.
Isolated Gate Driver from STMicroelectronics Safely Controls Silicon-Carbide MOSFETs
Joining STMicroelectronics’ STGAP family of isolated gate drivers, the STGAP2SiCS is optimized for safe control of silicon carbide (SiC) MOSFETs and operates from a high-voltage rail up to 1200V.
Samsung and TSMC Seeking to Spend Their Way to Worldwide Domination of Advanced IC Technology
Combined, the two companies are forecast to represent 43% of global semiconductor industry capital spending this year.
James Mitarotonda Joins Rambus Board of Directors
Rambus Inc. today announced that James Mitarotonda joined its Board of Directors as a Class I director with a term expiring at Rambus’ 2022 annual meeting of stockholders.
CAD Design Software Introduces Four New Electronics Packaging Designer (EPD) Suites Powered by AutoCAD OEM
CAD Design Software (CDS), a leader in Electronic Design Automation (EDA) software solutions, today announces the creation of four new Electronics Packaging Designer (EPD) suites, EPD for Windows Suites, powered by AutoCAD OEM.
Applied Materials Introduces New Playbook for Process Control Based on Big Data and AI
Applied Materials, Inc. today unveiled a major innovation in process control that uses Big Data and AI technology to help semiconductor manufacturers accelerate node development, speed time to revenue and earn more profits over the life of a node.
AP Memory and Ambiq Announce Partnership
AP Memory Technology Corporation together with Ambiq announce their partnership to enable richer experiences in next-generation battery-powered intelligent endpoint devices.
