SEMI announced today that the virtual Industry Strategy Symposium (ISS) 2021 will take place January 12-13 with the theme Bridging the Gap Between the Physical and Digital Worlds.
Packaging
SEMI Technology Unites Global Summit to Spotlight Digital Transformation, Microelectronics Industry Innovation and Growth
Global industry executives from all seven SEMI regions will gather online for the inaugural SEMI Technology Unites Global Summit, February 15-19, 2021, for keynotes on the power of technology to unite the world and insights on how the microelectronics industry can shape the digital future.
Henkel Debuts Non-Conductive, High Thermal Die Attach Paste with Automotive Grade Reliability
Expanding its line of automotive grade die attach materials for advanced semiconductor packages, Henkel has developed and commercialized LOCTITE ABLESTIK ABP 8920TC.
Semiconductor Equipment Consensus Forecast – Record Growth Ahead, SEMI Reports
Global sales of semiconductor manufacturing equipment by original equipment manufacturers are projected to increase 16% compared to $59.6 billion in 2019 and register a new industry record of $68.9 billion in 2020.
High-Rate Li-ion Batteries Demonstrate Superior Safety
As the inevitable growth of transport electrification continues, the types of batteries that will be used in such vehicles, their charging parameters, infrastructure and timeframes are key considerations that will speed up the transition to electrification.
Mikrotron Launches its First FPGA-Driven Smart Cameras with the New EoSens Creation Series
Mikrotron is empowering machine vision engineers to achieve accelerated performance at a fraction of the cost of traditional customized solutions with its new EoSensCreation Series of FPGA programmable-ready smart cameras.
DENSO Adopts SDK SiC Epi-wafers for Next-Generation Booster Power Modules for FCEVs
Silicon carbide epitaxial wafers (SiC epi-wafers), the main material for power semiconductors, with a diameter of six inches (150mm) and manufactured by Showa Denko K.K., have been adopted by DENSO Corporation for their latest booster power modules for fuel cell electric vehicles (FCEVs).
Physics Discovery Leads to Ballistic Optical Materials
Electronics are increasingly being paired with optical systems, such as when accessing the internet on an electronically run computer through fiber optic cables.
KLA Introduces Two New Systems That Take On Semiconductor Manufacturing’s Toughest Problems
Today KLA Corporation (NASDAQ: KLAC) announced two new products: the PWG5 wafer geometry system and the Surfscan SP7XP wafer defect inspection system. The new systems are designed to address exceedingly difficult issues in the manufacture of leading-edge memory and logic integrated circuits.
Spin Memory Joins Semiconductor Industry Association as First MRAM-focused Member
Spin Memory, Inc. (Spin Memory), the leading developer of MRAM technologies, today announced that it is joining the Semiconductor Industry Association (SIA).
