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Packaging
Busch Group Companies Announce Joint Presence at SEMICON West
The three companies of the Busch Group (Busch Vacuum Solutions, Pfeiffer Vacuum and centrotherm clean solutions) announce their joint presence at Semicon West 2024. It will be the inaugural occasion that the Busch Group exhibits collectively in one booth in the US.
New SEMI Governing Council for Smart MedTech Initiative to Connect Semiconductor and Life Science Communities
SEMI, the industry association serving the global electronics manufacturing and design supply chain, today announced the formation of a governing council for its Smart MedTech Initiative that will guide the initiative in its vision to revolutionize global healthcare through innovation, democratization, and pioneering advances in preventative care.
YES Panel-Level Through Glass Via Etch Tool Placed in Production
YES, a manufacturer of process equipment for semiconductor advanced packaging, life sciences and AR/VR applications, today announced that Its TersOnus TGV tool was released for panel-level manufacturing.
Faraday Joins Intel Foundry Accelerator Design Services Alliance
Faraday Technology Corporation announces joining the Intel Foundry Accelerator Design Services, marking a significant milestone in advancing ASIC design solutions for next-generation applications, including artificial intelligence (AI), high-performance computing (HPC), and AI-enabled vehicles.
How 5G Technology is Supercharging Semiconductors and Transforming Chip Design
Let us explore in detail the profound impact of 5G technology on this crucial sector, delving into the latest statistics and valuable information and shedding light on how companies adapt to this new era.
GlobalFoundries Acquires Tagore Technology’s GaN Technology
GlobalFoundries today announced that it has acquired Tagore Technology’s proprietary and production proven Power Gallium Nitride (GaN) IP portfolio.
Forge Nano Expands Semiconductor Business
Forge Nano, Inc., an ALD equipment provider and materials science company, today further expanded into the semiconductor market with the unveiling of its new Atomic Layer Deposition (ALD) product offering – TEPHRA – Forge Nano’s new single-wafer, ALD cluster platform.
Micron Releases 2024 Sustainability Report Highlighting Progress and Long-Term Vision
Micron Technology, Inc. today announced the release of its 2024 sustainability report.
Materials Research Revolutionized by a Small Change
POSTECH Professors Daesu Lee and Si-Young Choi develop the next generation of highly efficient memory materials with atom-level control.