Archer Materials Limited, a semiconductor company advancing the quantum technology and medical diagnostics industries, has sent a new graphene field effect transistor (gFET) design for its Biochip to VTT Technical Research Centre of Finland Ltd for manufacture 200mm diameter wafers via a MPW run for integration with CMOS readout.
Packaging
Veeco Announces Agreement with IBM to Explore Wet Processing Systems for Advanced Packaging Applications
Veeco Instruments Inc. (NASDAQ: VECO) today announced that IBM selected the WaferStorm Wet Processing System for Advanced Packaging applications and has entered into a joint development agreement to explore advanced packaging applications using multiple wet processing technologies from Veeco.
IMAPS 57th International Symposium on Microelectronics Planned for September 30 – October 3, 2024, in Boston
The 57th International Symposium on Microelectronics (IMAPS 2024) will be held September 30 – October 3, 2024, at the Encore Boston Harbor in Boston, Massachusetts.
Tachyum Builds Last FPGA Prototypes Batch Ahead of Tape-Out
Tachyum today announced the final build of its Prodigy FPGA emulation system in advance of chip production and general availability next year.
Movellus Joins the Silicon Catalyst In-Kind Partner Ecosystem
Movellus today announced that it has joined the Silicon Catalyst ecosystem as the newest member of their In-Kind Partner (IKP) network.
Microchip and Acacia Collaborate to Enable Optimized Terabit-Scale Data Center Interconnect Systems
The companies enable an interoperable coherent optics ecosystem that can help streamline the development of data center interconnect and metro transport systems.
SIA Applauds CHIPS Act Incentives for SK hynix
The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer applauding semiconductor manufacturing incentives announced by the U.S. Commerce Department and SK hynix.
Akoustis Announces Leadership Transition
Akoustis Technologies, Inc. announced today the mutually agreed resignation of Jeffery B. Shealy as Chief Executive Officer and as a member of the Board of Directors, effective August 6, 2024.
ACM Research Strengthens its Fan-Out Panel Level Packaging Portfolio with Launch of Ultra ECP ap-p Tool
ACM Research, Inc., a supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging applications, today announced its new Panel Electrochemical Plating (Ultra ECP ap-p) tool designed for fan-out panel-level packaging (FOPLP).
New Substrate Material for Flexible Electronics Could Help Combat E-Waste
Electronic waste is a rapidly growing problem, but this degradable material could allow the recycling of parts from many single-use and wearable devices.
