AGC Inc., a Tokyo-based world-leading manufacturer of glass, chemicals and high-tech materials, has announced the development of a glass package that is ideal for encapsulating edge-emitting laser diode (LD) chips.
Packaging
Erica Graham an AIM Photonics Journey
AIM Photonics, the Department of Defense (DoD) sponsored Integrated Photonics Manufacturing Institute, heads into its fifth year, with a number of notable accomplishments and technological achievements.
Global Semiconductor Sales Increase 6 Percent Year-to-Year in October; Annual Sales Projected to Increase 5.1 Percent in 2020
The Semiconductor Industry Association (SIA) today announced worldwide sales of semiconductors reached $39.0 billion for the month of October 2020, an increase of 6.0 percent compared to the October 2019 total of $36.8 billion and 3.1 percent more than the September 2020 total of $37.9 billion.
Intel Advances Progress in Integrated Photonics for Data Centers
Today, at Intel Labs Day, Intel highlighted industry-leading technological advances toward the realization of the company’s long-standing vision of integrating photonics with low-cost, high-volume silicon.
Nanomaterials Enable Dual-Mode Heating and Cooling Device
Engineers at Duke University have demonstrated a dual-mode heating and cooling device for building climate control that, if widely deployed in the U.S., could cut HVAC energy use by nearly 20 percent.
MagnaChip Launches New High-Voltage 700V/800V Super Junction MOSFETs
MagnaChip Semiconductor Corporation (“MagnaChip”) (NYSE: MX) today announced eight new 700V and 800V series high-voltage Super Junction Metal Oxide Semiconductor Field Effect Transistors (SJ MOSFETs), featuring high performance and efficiency and optimized for TV, LED lighting and fast charger applications.
IAR Systems and GigaDevice Extend Partnership With Powerful Arm Solutions
IAR Systems, the future-proof supplier of software tools and services for embedded development, and GigaDevice, an industry-leading semiconductor supplier, announced their powerful solutions for GD32 Arm-based microcontrollers (MCUs).
Third-Quarter 2020 Global Semiconductor Equipment Billings Surge 30% Year-Over-Year, SEMI Reports
Global semiconductor equipment billings surged 30% year-over-year and rose 16% to US$19.4 billion from the prior quarter, SEMI announced today in its Worldwide Semiconductor Equipment Market Statistics (WWSEMS) Report.
Status of the Advanced Packaging Industry
Revolutionary changes are happening in the advanced semiconductor packaging industry.
STMicroelectronics Reveals Compact 60V DC/DC Converters Featured for Extra Flexibility
The STMicroelectronics L7983 is a compact, 3V-60V, 300mA synchronous DC/DC buck converter with flexible, dynamic-mode selection to satisfy noise-sensitive applications and maximize efficiency at light load.
