Veeco Instruments Inc. (NASDAQ: VECO) today announced that a world leader in semiconductor assembly and testing has placed a multi-system order for its AP300 Lithography System for the production ramp of advanced packaging chips.
Packaging
Worldwide Semiconductor Revenue Grew 10.8% in 2020 to $464 Billion, Growth Will Accelerate This Year Despite Market Shortages, According to IDC
Despite the impact of COVID-19 on the global economy, the semiconductor market performed strongly in 2020. Demand by industry was uneven throughout the year due to global lockdowns, remote work and education, and shifts in consumer buying behavior.
JCET Completes RMB 5 Billion Private Placement with Diversified Investment Structure
JCET Group, a global provider of integrated circuit (IC) manufacturing and technology services, recently announced that the company successfully completed a capital raising of approximately RMB 5 billion.
Boston Semi Equipment Reports Record Backlog for Test Handlers
Boston Semi Equipment (BSE), a global semiconductor test automation and test handler company, today announced record orders for its test handlers.
SEMICON Europa, Messe München electronica 2022 Postponed One Week
SEMICON Europa 2022, co-located with electronica, will be postponed one week to November 15-18, SEMI announced today. The move follows Messe Munich’s announcement that it will postpone electronica for organizational reasons.
Model N and Channelnomics Announce Strategic Partnership
Model N Inc. (NYSE: MODN) today announced a new partnership with Channelnomics, a business strategy and research firm that enables high technology companies to assess, plan, and build channel program success.
PsiQuantum and GLOBALFOUNDRIES to Build the World’s First Full-scale Quantum Computer
PsiQuantum, a quantum computing company focused on delivering a 1 million-plus qubit quantum computer, and GLOBALFOUNDRIES (GF) today announced a major breakthrough in their partnership to build the world’s first full-scale commercial quantum computer.
Applied Materials Introduces Materials Engineering Solutions for DRAM Scaling
Applied Materials, Inc. today announced materials engineering solutions that give its memory customers three new ways to further scale DRAM and accelerate improvements in chip performance, power, area, cost and time to market (PPACt).
Gel-Pak Collaborates with BAE Systems on Packaging Solution for Thin Semiconductor Devices
Gel-Pak, a division of Delphon and a manufacturer of protective device carrier and film products for the semiconductor and optoelectronics industries announces its collaboration with BAE Systems on a new product called the Lid/Clip Super System (LCS2).
Akoustis Locks Process Flow for Second Wafer Level Package for XBAW Filters
Akoustis Technologies, Inc., an integrated device manufacturer (IDM) of patented bulk acoustic wave (BAW) high-band RF filters for mobile and other wireless applications, announced today that it has locked the process flow for its second chip scale package (CSP).
