Fueled by surging pandemic-inspired demand for electronics devices, the global semiconductor industry is on track to register a rare three consecutive years of record highs in fab equipment spending with a 16% increase in 2020 followed by forecast gains of 15.5% this year and 12% in 2022.
Packaging
BISTel Features Big Data-Driven Smart Analytical Solutions Designed for China’s Semiconductor Manufacturing Sector at SEMICON China 2021
BISTel announced today that it will provide a preview to its smart manufacturing strategy for China at the annual Semicon China exposition in Shanghai, March 17-19, 2021.
Elliptic Labs Appoints New CFO
Elliptic Labs (EuroNext Growth: ELABS.OL) announced today that Lars Holmøy is appointed as the new CFO and Investor Relations (IR) effective June 1, 2021.
Mouser Electronics Recognized as Global Distributor of the Year by Littelfuse for Tenth Year
This is the 10th time that Mouser has been honored with the top award.
Amber Solutions’ Energy Traffic Controller Promises Greater Building Electrical Efficiency and Stability Enabled by Hyper-Intelligent, Autonomous Energy Source Selection
Amber Solutions, the Silicon Valley company that is making the digital control of electricity in solid-state architecture a commercial reality, today announced the latest innovative design to leverage its technology — a solid-state based Energy Traffic Controller with embedded intelligence that enables on-the-fly switching of building electricity sources.
IC Insights Raises Its 2021 IC Market Forecast from 12% to 19% Growth
Rising market expectations are being witnessed across most IC product lines from Analog to Logic to DRAM.
Seal-Connect Provides Reliable Electrical & Fiber Optic Connectors
Proprietary technology ensures signal continuity in harsh environments in multiple industries.
ACM Research Significantly Improves Copper Plating Rate and Uniformity for Advanced Packaging Applications with New High-Speed Plating Technology
New ECP ap capability controls the wafer-level electric field to deliver better uniformity within wafer and within die while achieving higher throughputs.
StratEdge Announces Increased Manufacturing Capacity of Outline Glass Sidewall Thermally Enhanced Packages for Power Semiconductors
StratEdge Corporation announces the increased capacity for manufacturing the small outline thermally enhanced alumina/glass sidewall packages for power semiconductors.
Frost & Sullivan Assesses Top Priorities in IT Investments in Leading Industries Around the Globe
Frost & Sullivan’s recent analysis, 2021 Predictions—COVID-19 Accelerates CX Investments, finds that organizations across the globe are inclined to invest in advanced technologies such as the Internet of Things (IoT) and artificial intelligence (AI) to enhance the customer experience (CX) and overcome the adverse impact of COVID-19.
