Dialog Semiconductor plc, a provider of battery and power management, Wi-Fi, Bluetooth low energy (BLE) and Industrial edge computing solutions today announced that AST & Science, LLC, a satellite company that is disruptively transforming satellite broadband access, has selected Dialog to develop four custom mixed-signal & RF ASICs for their SpaceMobile network.
Packaging
STMicroelectronics and Advantest Collaborate on Advanced Automated Test Cell for IC Testing
Semiconductor test equipment supplier Advantest Corporation and STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, announced that they have jointly developed an advanced, fully-automated final-test cell system that improves overall equipment efficiency and quality in semiconductor test and packaging operations.
TechSearch International Examines HBM Growth and Package Options for HBM + Logic
The market for high bandwidth memory (HBM) is projected to grow 49% in wafers, including DRAM and logic layers, from 2020 to 2024.
proteanTecs CEO to Present Universal Chip Telemetry at the Taiwan Semiconductor Executive Summit (TSES)
proteanTecs, a developer of Deep Data solutions for electronics’ health and performance monitoring, will present at the Taiwan Semiconductor Executive Summit (TSES), taking place in Hsinchu on December 1-2, 2020.
Qorvo CEO Bob Bruggeworth Elected Chair of Semiconductor Industry Association
The Semiconductor Industry Association (SIA) Board of Directors today elected Bob Bruggeworth, President, CEO, and Director of Qorvo, as its 2021 Chair and Steve Mollenkopf, CEO and Director of Qualcomm Incorporated, as its 2021 Vice Chair.
Perfect Imperfection: Electrode Defects Boost Resistive Memory Efficiency
Resistive switching memory devices offer several advantages over the currently used computer memory technology. Researchers from the MIPT Atomic Layer Deposition Lab have joined forces with colleagues from Korea to study the impact of electrode surface morphology on the properties of a resistive switching memory cell.
ACM Research Enters 3D TSV Copper Plating Market with Ultra ECP 3d Platform
ACM Research, Inc., a supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, today introduced its Ultra ECP 3d platform for conformally filled 3D through-silicon via (TSV) applications.
Alchip Technology Announces Record Q3 Earnings
Alchip Technologies third quarter of 2020 achieved a record net income $7.87 million on record revenue of $67.68 million. The company also reported continued growth in the high-performance computing market segment.
Collaboration Helps Military Veterans Transition into NDT Careers
Olympus, a leading manufacturer of nondestructive testing (NDT) equipment, is supporting training school Warrior To Inspector’s mission to help transition retiring military veterans into a new NDT career by providing advanced inspection instruments for their ultrasonic testing (UT) courses.
Xperi Licenses DBI to Canon for CMOS Image Sensors
Xperi Holding Corporation today announced Canon’s license of Invensas DBI hybrid bonding intellectual property (IP) portfolio to further enhance its image sensors.
