Jenoptik’s new UFO Probe technology targets the market for semiconductor equipment and processes for wafer-level testing in microelectronics.
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Marvell Announces Industry’s First 112G 5nm SerDes Solution for Scaling Cloud Data Center Infrastructure
Marvell today unveiled the industry’s first 112G 5nm SerDes solution that has been validated in hardware.
CyberOptics to Present Technical Paper ‘Fast, 100% Wafer Bump Metrology and Inspection’ at Virtual IEEE PAINE Conference
CyberOptics Corporation, a leading global developer and manufacturer of high-precision 3D sensing technology solutions, will present at the Virtual IEEE International Conference on Physical Assurance and Inspection of Electronics (PAINE) on December 16th at 8:00amCT.
GaN Systems Expands Power Market with GaN Power Module Evaluation Kits
GaN Systems announced the availability of four new integrated power module evaluation kits: 100V Driver GaN DC/DC Power Stage Module, 650V 150A Half-Bridge IPM, 650V 150A Full-Bridge Module and Driver, and 650V 300A 3-Phase Module and Driver.
Wet Copper Deposition Materials for ICs and Packages
TECHCET announces that the global market for wet metal deposition materials including electro-chemical deposition (ECD) and plating (ECP) chemistry blends in 2020 is forecast to be US$63 million.
Kandou Raises $92.3 Million in Series C Funding
Kandou, an innovative leader in high-speed, energy-efficient, chip link solutions, today closed its Series C round of funding, resulting in $92.3 million raised in the round.
Professors from Stanford, UC Berkeley to be Honored for Excellence in Semiconductor Research
The Semiconductor Industry Association (SIA) and the Semiconductor Research Corporation (SRC) today announced the winners of the 2020 SIA-SRC University Research Awards.
Researchers Make Key Advance for Printing Circuitry on Wearable Fabrics
Electronic shirts that keep the wearer comfortably warm or cool, as well as medical fabrics that deliver drugs, monitor the condition of a wound and perform other tasks, may one day be manufactured more efficiently thanks to a key advance by Oregon State University researchers.
New ASIL-D Certificate Boost Safety and Security Credentials of Winbond’s W75F Secure Memory Element
Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced that its W75F, the industry’s first Secure Flash memory device with Common Criteria EAL5+ certificate, has now achieved the ISO26262 ASIL Grade D safety certification.
Efinix Announces Trion Titanium Tapeout at TSMC 16nm Process Node
Efinix, an innovator in programmable product platforms and technology, today announced the tapeout of its Ti60 FPGA at TSMC’s 16 nm process node.
