Lattice Semiconductor Corporation, the low power programmable leader, today announced the Lattice Design Group (LDG) to bring added focus to its comprehensive design services for accelerating the development of differentiated, value-added customer applications.
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New Approach to Circuit Compression Could Deliver Real-World Quantum Computers Years Ahead of Schedule
A major technical challenge for any practical, real-world quantum computer comes from the need for a large number of physical qubits to deal with errors that accumulate during computation.
Micron Ships World’s First 176-Layer NAND, Delivering A Breakthrough in Flash Memory Performance and Density
Micron Technology, Inc. (Nasdaq: MU), today announced shipment of the world’s first 176-layer 3D NAND flash memory, achieving unprecedented, industry-pioneering density and performance.
Saving Energy with Intelligent Vacuum Technology
Busch Vacuum Solutions has now launched the COBRA NX 0950 A PLUS, the second vacuum pump in the new PLUS series. It is a dry, oil-free vacuum pump, which can run with pressure control or at a constant rotational speed, making it exceptionally energy-efficient.
Dialog Semiconductor Announces SLG47004 GreenPAK First Fully Programmable Advanced Analog System IC
Dialog Semiconductor plc(XETRA:DLG), a leading provider of battery and power management, Wi-Fi, Bluetooth low energy (BLE) and Industrial edge computing solutions, today announced the SLG47004, Dialog’s first Advanced Analog GreenPAK IC.
3D-Micromac Unveils High-Throughput Selective Laser Annealing System for Magnetic Sensor Manufacturing
3D-Micromac AG, the industry leader in laser micromachining and roll-to-roll laser systems for the semiconductor, photovoltaic, medical device and electronics markets, today introduced the first industrial selective laser annealing system for magnetic sensor formation — the microVEGA™ xMR. Incorporating a highly flexible, high-throughput tool configuration with on-the-fly spot and variable laser energy, the microVEGA xMR accommodates both Giant Magnetoresistance (GMR) and Tunnel Magnetoresistance (TMR) sensors, as well as easily adjusts magnetic orientation, sensor position…
2020 IEEE International Electron Devices Meeting (IEDM) Announces Virtual Events Schedule & Technical Highlights
The 66th annual edition of the IEEE International Electron Devices Meeting (IEDM), the world’s premier forum for the presentation of applied research in transistors and related devices, has announced the details of its virtual schedule.
DRAM Price Erosion Expected Through the End of 2020
Price jump that typically coincides with the introduction of new smartphone models in 3Q and 4Q is not expected due to disrupted buying patterns and cautious discretionary spending.
CEA-Leti to Present Latest Results & Insights on 3D Technologies, Power Electronics & Quantum Computing at IEDM 2020
CEA-Leti will unveil its latest scientific results in 3D sequential integration for neural networks, 3D RRAM for in-memory computing and GaN-on-Si for power electronics at IEDM 2020, Dec. 12-16. The event will be held virtually because of the coronavirus pandemic.
SK hynix to Acquire Intel NAND Memory Business
SK hynix and Intel will endeavor to obtain required governmental approvals, expected in late 2021.
