Kioxia Corporation and Western Digital Corp. today announced that the companies have developed their sixth-generation, 162-layer 3D flash memory technology.
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Illumipure Develops Air Guardian Enclosed Air Disinfection Chamber Using UV LED Technology to Disinfect >99% of Airborne Pathogens
Illumipure, a manufacturer of innovative LED lighting and disinfection systems for commercial and institutional applications, has developed an enclosed air disinfection chamber that eliminates >99% of airborne pathogens, including viruses, mold, and bacteria.
Broad Coalition of Tech, Medical, Auto, Other Business Leaders Urge President Biden to Fund Domestic Semiconductor Manufacturing, Research in Infrastructure Plan
The Semiconductor Industry Association (SIA), along with a broad coalition of 16 other tech, medical, auto, and other business groups, today in a letter urged President Biden to work with Congress to fully fund domestic semiconductor manufacturing and research provisions established in the recently enacted National Defense Authorization Act (NDAA).
ON Semiconductor Announces New 650V Silicon Carbide MOSFETs
ON Semiconductor has announced a new range of silicon carbide (SiC) MOSFET devices for demanding applications where power density, efficiency and reliability are key considerations.
Infinitesima Ships First RPM 3D System
Infinitesima Ltd announced the shipment of the first RPM 3D system to jointly develop 3-dimensional metrology applications for characterisation of semiconductor devices in collaboration with imec.
Samsung Develops Industry’s First High Bandwidth Memory with AI Processing Power
Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has developed the industry’s first High Bandwidth Memory (HBM) integrated with artificial intelligence (AI) processing power — the HBM-PIM.
SEMI Technology Unites Global Summit Opens with Executive Forum, Digital Transformation, Security and Sustainability in Spotlight
SEMI Technology Unites Global Summit opens today with keynotes on the power of technology to unite the world and insights on how the microelectronics industry can enable a secure and sustainable digital future.
European SEMI Award Honors KU Leuven, TU Dresden and CEA-Leti for Key Chip Industry Contributions
The Catholic University of Leuven, Technical University of Dresden and CEA-Leti have won the 2019 European SEMI Award at the SEMI Technology Unites Global Summit for their pivotal contributions in the fields of telecommunications and nanotechnology.
Thermo Scientific Helios 5 PXL PFIB Wafer DualBeam Enables Inline Metrology of Advanced 3D Structures
Thermo Fisher Scientific, the world leader in serving science, today launched the Thermo Scientific Helios 5 PXL PFIB Wafer DualBeam. The system, a plasma focused ion beam scanning electron microscope, reduces time-to-data from days to hours for inline through-stack metrology and verification of high-aspect ratio structures.
A Performance Leap for Graphene Modulators In Next Generation Datacom and Telecom
Over the past years, global data traffic has experienced a boom, with over 12.5 billion connected devices all over the world. The current world-wide deployment of the 5G telecommunications standard is triggering the need for smaller devices with enhanced performances, such as higher speed, lower power consumption and reduced cost as well as easier manufacturability.
