DELO, one of the world’s leading manufacturers of industrial adhesives for automotive, consumer and industrial electronics applications, has developed two liquid pressure-sensitive adhesives that have similar properties to (double-sided) adhesive tapes, but are applied in liquid form.
Packaging
Q3 Global Semiconductor Sales Increase 11 Percent Compared to Q2
The Semiconductor Industry Association (SIA) today announced worldwide sales of semiconductors totaled $113.6 billion during the third quarter of 2020, an increase of 11.0 percent over the previous quarter and 5.8 percent more than the third quarter of 2019.
Cadence Wins Four 2020 TSMC OIP Partner of the Year Awards
Cadence Design Systems, Inc. announced that it has received four OIP Partner of the Year awards from TSMC for IP and EDA solutions.
‘Transparent Solar Cells’ Can Take Us Towards a New Era of Personalized Energy
Today, the imminent climate change crisis demands a shift from conventionally used fossil fuels to efficient sources of green energy. This has led to researchers looking into the concept of “personalized energy,” which would make on-site energy generation possible.
300mm Fab Spending to Boom Through 2023 With Two Record Highs, SEMI Reports
300mm fab investments in 2020 will grow by 13% year-over-year (YoY) to eclipse the previous record high set in 2018 and log another banner year for the semiconductor industry in 2023, SEMI reported today in its 300mm Fab Outlook to 2024.
SEMICON Japan 2020 Goes Virtual to Highlight Electronics Innovations Powering a Smarter World
The promise of growing prosperity worldwide through digital transformation and smart technology innovations will take center stage at SEMICON Japan 2020 Virtual, December 11-18, as industry leaders and visionaries gather for the latest technologies, developments and trends across the electronics manufacturing and design supply chain.
Synopsys and Samsung Release Certified 3nm Gate-All-Around AMS Design Reference Flow for Early Design Starts
Synopsys, Inc. announced the release of the 3-nanometer (nm) gate-all-around (GAA) AMS Design Reference Flow, which provides designers a complete front-to-back design methodology for designing analog and mixed-signal circuits using the Synopsys Custom Design Platform.
Silicon Wafer Shipments Slip in Third Quarter 2020 but Strong for Year
Worldwide silicon wafer area shipments contracted 0.5% to 3,135 million square inches in the third quarter of 2020 compared to the second quarter of the year but registered a 6.9% increase from the 2,932 million square inches shipped one year ago during the same quarter.
CEA-Leti Announces Collaboration with Intel to Advance Chip Design Through Cutting-Edge 3D Packaging Technologies
CEA-Leti today announced a new collaboration with Intel on advanced 3D and packaging technologies for processors to advance chip design.
Transphorm Releases Latest High Voltage GaN Reliability Data
Transphorm, Inc. (OTCQB: TGAN)—a pioneer in and global supplier of high reliability, high performance gallium nitride (GaN) power conversion products—today released updated information regarding its GaN technology’s quality and reliability (Q+R).
