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ASM Pacific Technology and EV Group Join Forces to Enable Industry’s First Ultra Precision Die-to-Wafer Hybrid Bonding Solutions for 3D-IC Heterogeneous Integration

ASM PACIFIC TECHNOLOGY (ASM) and EV GROUP (EVG) announced the signing of a joint development agreement (JDA) to co-develop die-to-wafer hybrid bonding solutions for 3D-IC/heterogeneous integration applications.

Renesas and Dialog Semiconductor to Join Forces to Advance Global Leadership in Embedded Solutions

Renesas Electronics Corporation and Dialog Semiconductor Plc announced they have reached an agreement on the terms of a recommended all-cash acquisition by Renesas of the entire issued and to be issued share capital of Dialog (the “Acquisition”) for EUR 67.50 per share, representing a total equity value of approximately EUR 4.9 billion (approximately 615.7 billion yen).

Total MPU Sales Surprise with Strong Gains in 2020, More Upside in 2021

IC Insights recently released its 2021 edition of The McClean Report. The new analysis and forecast of the IC industry includes an analysis and forecast of the total microprocessor (MPU) market, including computer CPUs for PCs, tablets, and servers, embedded MPUs, and cellphone application MPUs.

Top-10 IC Growth Categories Target Emerging Applications in 2021

Each of the top-10 growing IC product categories is expected to see a double-digit increase in sales, but only the top-five segments are forecast to grow faster than the total IC market, which IC Insights projects will rise 12% this year.

CyberOptics to Showcase High-Precision Inspection and Metrology Solutions at SEMI Technology Unites Global Summit

CyberOptics Corporation will feature the WX3000 metrology and inspection system with Multi-Reflection Suppression™ (MRS) sensor technology, and high-precision sensors for semiconductor tool set-up and diagnostics at the Virtual SEMI Technology Unites Global Summit from February 15-19th.

Synopsys Demonstrates Silicon Proof of DesignWare 112G Ethernet PHY IP in 5nm Process for High-Performance Computing SoCs

Synopsys, Inc. today announced the silicon proof of DesignWare 112G Ethernet PHY IP in 5nm FinFET process, delivering significant performance, power and area advantages.

Top-10 IC Growth Categories Target Emerging Applications in 2021

IC Insights recently released its 2021 edition of The McClean Report. The new analysis and forecast of the IC industry includes IC Insights’ ranking of IC categories based on sales growth rate.

Lam Research Advances Next Generation 3D Memory Manufacturing with Revolutionary New Etch Technology

Lam Research Corp. today announced Vantex, the latest in dielectric etch technology designed specifically for Sense.i, the most intelligent etch platform available today.

D2S Unleashes the Petaflops Computing Era for Semiconductor Manufacturing

D2S, a supplier of GPU-accelerated solutions for semiconductor manufacturing, today introduced the seventh generation of its computational design platform (CDP), a scalable processing solution for simulation-based semiconductor design and manufacturing applications.

Process Technology Unveils the SHX Family of Products

Process Technology, a leading manufacturer of inline, ultra-high purity heaters for the semiconductor industry, is excited to announce its new family of SHX and SHX-EX heaters for IPA and flammable solvents.

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