Kioxia Corporation today announced it will begin construction of a fabrication facility (Fab7) at Yokkaichi Plant in Mie Prefecture, Japan to expand production of its proprietary 3D Flash memory BiCS FLASH.
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Ansys Multiphysics Solutions Certified for Samsung Foundry’s Entire Line of FinFET Process Technologies
Ansys achieved new certifications of its leading-edge suite of semiconductor design solutions for all Samsung Foundry FinFET process nodes.
Synopsys and Samsung Foundry Collaboration Delivers Portfolio of Optimized iPDKs and Methodologies for Advanced Custom Design
Synopsys, Inc. today announced that in collaboration with Samsung Foundry, more than 30 new interoperable process design kits (iPDKs) have been jointly developed, validated and support the Synopsys Custom Design Platform.
Aldec’s TySOM Family of Embedded System Development Solutions Now Supports Xilinx PYNQ (Python Productivity for Zynq)
Aldec, Inc., a pioneer in mixed HDL language simulation and hardware-assisted verification for FPGA and ASIC designs, has added PYNQ Python Productivity for Zynq from Xilinx, Inc. to its TySOM family of Xilinx Zynq SoC based boards and its TySOM Embedded Development Kit.
Tom Friedman to Deliver Keynote Address at 2020 SIA Leadership Forum & Award Celebration
The Semiconductor Industry Association today announced Thomas L. Friedman, longtime foreign affairs columnist at The New York Times and bestselling author of The World is Flat, will deliver the keynote address at the 2020 SIA Leadership Forum & Award Celebration.
New Semiconductor Chip from NS Nanotech Emits Far-UVC Disinfectant Ultraviolet Light to Neutralize Coronavirus
NS Nanotech announced today that it has broken major barriers in semiconductor device design with the first solid-state emissive material to produce invisible shortwave far-UVC ultraviolet light that researchers say can deactivate the SARS-CoV-2 virus and other airborne pathogens.
North American Semiconductor Equipment Industry Posts September 2020 Billings
The semiconductor industry remains resilient despite challenges posed by the pandemic and geopolitical tensions.
NEC and Analog Devices Collaborate to Provide 5G O-RAN Massive MIMO Radio for Rakuten Mobile
NEC Corporation and Analog Devices, Inc. announced today that they have teamed up to design a 5G Network Massive MIMO Antenna Radio Unit for Rakuten Mobile.
SiPearl Joins the CXL Consortium Behind Compute Express Link, the Breakthrough CPU-to-Device Interconnect
SiPearl has joined the CXL Consortium, whose founding members are the world leaders Alibaba, Cisco, Dell EMC, Facebook, Google, Hewlett Packard Enterprise, Huawei, Intel Corporation and Microsoft.
TSMC Recognizes Synopsys Collaboration with Four OIP Partner of the Year Awards for IP and EDA Solutions
Synopsys, Inc. today announced it has received four 2020 OIP Partner of the Year awards for IP and EDA solutions from TSMC demonstrating excellence in next-generation system-on-chip (SoC) and 3DIC design enablement.
