With this collaboration, Marvell and TSMC are advancing the essential technology underpinning this infrastructure to provide the storage, bandwidth, speed, and intelligence that tomorrow’s digital economy demands.
Packaging
SEMI Statement on New U.S. Export Control Regulations
SEMI, the industry association serving the global electronics design and manufacturing supply chain, today released the following statement in response to the new export control rule changes announced by the United States Commerce Department.
High-Function Polyol Additives Improve Performance of Electronics Adhesives
Adhesives used in electronics assemblies must perform without fail to protect delicate components from vibration and heat. They must also be able to secure the components without interfering with the operation of the end product.
Monzukuri Unveils First Commercially-Available IC/Package Co-Design Tool
Monozukuri S.p.A, today unveiled GENIO, the first commercially available IC/Package Co-Design Tool. The company said that it is able to take orders for GENIO now. GENIO is revolutionary fully integrated, design environment-agnostic end-to-end IC and packaging co-design EDA platform for 2D/2.5D/3D system design.
Consumer Electronics Market is Set to Surpass $1,500B by 2026
According to a recent study from market research firm Global Market Insights, the demand for consumer electronics market is anticipated to grow at a significant rate on account of increasing purchase of devices integrated with latest technologies.
TrendForce Analyzes Impacts of Expanded U.S. Sanctions Against Huawei on Five Major Tech Industries
TrendForce provides the following analyses on the impacts that the expanded sanctions against Huawei have on five tech industries, including semiconductors, memory products, smartphones, display panels, and 5G communications.
Subaru Selects Xilinx to Power New-Generation EyeSight System
Xilinx, Inc. (NASDAQ: XLNX) today announced that its technology is powering the new version of Subaru’s vision-based advanced driver-assistance system (ADAS), EyeSight.
Alpha and Omega Semiconductor Announces a New High SOA MOSFET for 12V Hot Swap Applications
Alpha and Omega Semiconductor Limited (AOS) (Nasdaq: AOSL), a designer, developer and global supplier of a broad range of power semiconductors, power ICs, and Digital Power products today announced the release of, AONS32310, a 30V MOSFET with low on-resistance and a high Safe Operating Area (SOA) capability which is ideally suited for demanding applications such as hot swap and effuse.
Arm and DARPA Sign Partnership Agreement to Accelerate Technological Innovation
Arm today announced a three-year partnership agreement with the U.S. Defense Advanced Research Projects Agency (DARPA), establishing an access framework to all commercially available Arm technology. With DARPA’s Electronics Resurgence Initiative gaining momentum, the new agreement will enable the research community that supports DARPA’s programs to quickly and easily take advantage of Arm’s leading IP, tools and support, accelerating innovation in a variety of fields.
Tech Innovation to Improve Resiliency and Agility Will Be Critical Post-COVID-19, Says Lux Research
COVID-19 has drastically changed the landscape for businesses across all industries, forcing immediate changes – but ones that will have long-term consequences. In the latest report by Lux Research, “The Impact of COVID-19 on Tech Innovation,” Lux outlines five key trends that will define how the world beyond the pandemic will be different.
