The Semiconductor Industry Association (SIA) and the Semiconductor Research Corporation (SRC) today released a preview of their upcoming “Decadal Plan for Semiconductors,” a report outlining chip research and funding priorities over the next decade that will help strengthen U.S. semiconductor technology and spur growth in emerging technologies such as artificial intelligence, quantum computing, advanced wireless communications.
Packaging
ACM Research Highlights Availability of Wafer-Level Packaging Processing Equipment Portfolio for OSAT Customers
ACM Research, Inc., a supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, today highlighted the availability of its extended portfolio of wet wafer processing tools designed to meet the advanced technology requirements of outsourced semiconductor assembly and test (OSAT) providers.
Industry’s First Automotive-Compliant 40V Dual MOSFET in 3.3mm x 3.3mm Package Introduced by Diodes Incorporated
Diodes Incorporated today announced the industry’s first automotive-compliant 40V dual MOSFET in a 3.3mm x 3.3mm package.
STMicroelectronics Acquires Power Amplifier and RF Front-End-Module Specialist SOMOS Semiconductor
STMicroelectronics today announced the acquisition and integration of the assets of SOMOS Semiconductor.
Olympus and Hellier NDT Extend Collaboration to Train Future NDT Inspectors
Furthering a partnership that began in 1986, Olympus, a leading manufacturer of nondestructive testing (NDT) solutions, has supplied Hellier’s Houston, Texas location with advanced NDT inspection equipment.
GlobalFoundries Accelerating Innovation in IoT and Wearables with Adaptive Body Bias Features on 22FDX Platform
GLOBALFOUNDRIES (GF) announced today at its Global Technology Conference (GTC) EMEA event that it is accelerating innovation in the IoT and wearables markets with the specialized Adaptive Body Bias (ABB) feature of its industry-leading 22FDX platform.
GreenWaves Technologies Announces Next Generation GAP9 Hearables Platform Using GlobalFoundries 22FDX Solution
GreenWaves Technologies today announced a next-generation hearables platform based on its GAP9 IoT application processor using GLOBALFOUNDRIES (GF) 22FDX solution. The announcement was made at GF’s annual Global Technology Conference (GTC).
Intel Xeon Scalable Platform Built for Most Sensitive Workloads
Intel today unveiled the suite of new security features for the upcoming 3rd generation Intel® Xeon® Scalable platform, code-named “Ice Lake.” Intel is doubling down on its Security First Pledge, bringing its pioneering and proven Intel® Software Guard Extension (Intel® SGX) to the full spectrum of Ice Lake platforms, along with new features that include Intel® Total Memory Encryption (Intel® TME), Intel® Platform Firmware Resilience (Intel® PFR) and new cryptographic accelerators…
Temperature Sensor Market is Projected to Reach USD 9 Billion by 2026
According to a recent study from market research firm Global Market Insights, The temperature sensor market is projected to garner noteworthy gains on account of surging application across diverse electronic appliances.
A-Pro Semicon Chooses Veeco’s Propel HVM Platform for the Deveopment of GaN Power Seimconductor and 5G RF Devices
Veeco Instruments Inc. announced that A-Pro Semicon, Co., Ltd, a subsidiary of A-Pro’s semiconductor business based in Korea, has selected Veeco’s Propel HVM MOCVD system for the development and production of GaN-based power and 5G RF semiconductor devices.
