Samsung Electronics Co. today announced that it has expanded its DDR5 DRAM memory portfolio with the industry’s first 512GB DDR5 module based on High-K Metal Gate (HKMG) process technology.
Packaging
Semiconductor Materials Supply-Chain Shortages
TECHCET CA LLC’s prediction of a wet chemical supply fallout is materializing.
CHIPS Alliance and RISC-V International Invite the RISC-V Community to Participate in Updating a New Unified Memory Architecture Standard
New joint working group will enhance the OmniXtend Cache Coherency architecture.
What’s in the March Issue?
Each issue of Semiconductor Digest has articles found only in the magazine! Read the March issue…
Intevac Announces MATRIX Order for Fan-Out Applications in the Advanced Semiconductor Packaging Market
Intevac, Inc. today announced an INTEVAC MATRIX PVD order for fan-out applications in the advanced semiconductor packaging market.
Cadence Successfully Tapes Out Tensilica SoC on GLOBALFOUNDRIES 22FDX Platform Using Adaptive Body Bias Feature
Cadence Design Systems, Inc. today announced that it has collaborated with GLOBALFOUNDRIES to successfully tape out a Cadence Tensilica test chip on GF’s 22FDX platform.
Teledyne e2v HiRel Unveils Two New High-Power PIN Diode Limiter Modules
Limiter modules are designed for high reliability EW, radar applications. SCDs are supported, devices are tested and shipped from Teledyne’s certified US production facility
Micron Achieves Comprehensive Global Pay Equity for All Underrepresented Groups
Micron Technology, Inc. today announced that it has reached comprehensive global pay equity in total employee compensation across base, bonuses and stock rewards.
SEMICON Southeast Asia Rescheduled to 23-27 August 2021 as Hybrid Event
SEMI, the global industry association representing the electronics manufacturing and design supply chain, today announced the rescheduling of SEMICON Southeast Asia (SEA) to 23-27 August 2021 as a hybrid event to ensure the safety of exhibitors, partners and guests as the world continues to combat the COVID-19 pandemic and the rollout of vaccines progresses.
North American Semiconductor Equipment Industry Posts February 2021 Billings, Surpassing $3 Billion for Second Consecutive Month
The billings figure is 3.2 percent higher than the final January 2021 billings of $3.04 billion and is 32 percent higher than the February 2020 billings level of $2.37 billion.
