Packaging

Five Trends That Will Shape the Future Semiconductor Technology Landscape

Is Moore’s Law still alive, and which applications will benefit from ultra-scaled technologies? How will data centers cope with the overwhelming amount of data? And will we be able to break the memory wall in traditional Von Neumann computing architectures?

Arm Spins-out Cerfe Labs to Advance Development of CeRAM Memory Technology

Today, Arm announced the spin-out of Cerfe Labs to develop and license new types of non-volatile memories based on correlated electron materials (CeRAM) and ferroelectric transistors (FeFETs).

Thomas L. Deitrich Joins the ON Semiconductor Board of Directors

ON Semiconductor Corporation today announced that Thomas L. Deitrich was appointed to its board of directors.

Intel Wins US Government Advanced Packaging Project

The U.S. Department of Defense has awarded Intel Federal LLC the second phase of its State-of-the-Art Heterogeneous Integration Prototype (SHIP) program.

Busch Innovation in Vacuum Award Goes to Dilo

Dilo Armaturen und Anlagen GmbH has received the “Busch Innovation in Vacuum Award” from Busch Vacuum Solutions. The prize commends Dilo’s pioneering work in handling gases.

Palomar Technologies New 8100 Wire Bonder Increases Productivity and Efficiency

Palomar Technologies, a global leader in total process solutions for advanced photonics and microelectronic device packaging today announced the availability of their new Palomar 8100 Wire Bonder.

ULVAC Provides Total Service Solutions to U.S. and European-Based Vacuum Companies That Would Like to Expand in Japan and East Asia

ULVAC Technologies, Inc. (www.ulvac.com) has announced that their sister company, ULVAC TECHNO, Ltd. is offering U.S. and European-based vacuum companies a means of expanding their presence in Japan and East Asia (Korea, China, Taiwan).

Imint and MediaTek To Bring Advanced Video Enhancement Technology to More Smartphones & Other Mobile Devices Worldwide

IMINT Image Intelligence AB (“Imint”), a global leader in video enhancement software, today announced its collaboration with Taiwanese fabless chipset company MediaTek to significantly advance the adoption of video enhancement technology in smartphones and other mobile devices by enabling the integration of Imint’s Vidhance software suite into new MediaTek’s chipsets.

Kaman KD-5600 Family of Digital Differential Measuring Systems Ideal for Wide Range of Applications, Industries

The Measuring Division of Kaman Precision Products, Inc., the world leader in the design and manufacture of high-performance position measurement systems, announces that the KD-5600 family of eddy current measurement systems is ideal for use in COTS applications for fast steering mirrors, magnetic bearing active control, shaft vibration, image stabilization, and adaptive optics.

Synopsys and GLOBALFOUNDRIES Collaborate to Expand Fusion Compiler Benefits for Latest Platforms

This collaboration will enable the fast-tracking of next-generation, market-shaping products in verticals such as aerospace and defense, automotive, data center, IoT and mobile on GF’s feature-rich platforms.

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