Seeking to bolster the semiconductor industry workforce in the U.S. by addressing gaps in child care needs, the SEMI Foundation and Policy Equity Group today announced a collaboration to help companies comply with child care requirements under the U.S. CHIPS and Science Act.
Packaging
U.S. Department of Commerce Announces Funds to SK hynix’s AI Memory Chip Facility
The preliminary memorandum of terms between the South Korean semiconductor manufacturer and the U.S. Department of Commerce will support high-bandwidth-memory AI chip production and advanced packaging R&D.
NEO Semiconductor Announces the Development of its 3D X-AI Chip
NEO Semiconductor, a developer of innovative technologies for 3D NAND flash memory and 3D DRAM, announced today the development of its 3D X-AI chip technology, targeted to replace the current DRAM chips inside high bandwidth memory (HBM) to solve data bus bottlenecks by enabling AI processing in 3D DRAM.
Global Semiconductor Sales Increase 18.3% in Q2 2024 Compared to Q2 2023
The Semiconductor Industry Association (SIA) today announced global semiconductor industry sales totaled $149.9 billion during the second quarter of 2024, an increase of 18.3% compared to the second quarter of 2023 and 6.5% more than the first quarter of 2024.
Micron Develops Industry’s First PCIe Gen6 Data Center SSD for Ecosystem Enablement
Micron Technology, Inc. today announced it is the first to develop PCIe Gen6 data center SSD technology for ecosystem enablement as part of a portfolio of memory and storage products to support the broad demand for AI.
M31 Collaborates With Tower Semiconductor
M31 Technology Corporation announced a collaboration with Tower Semiconductor yielding the successful development of static random access memory (SRAM) and read-only memory (ROM) IP products using a 65nm process.
Tablet Market Finally Moves Past the Pandemic Era with Solid Growth in Q2 2024
Worldwide tablet shipments recorded year-over-year growth of 22.1% in the second quarter of 2024 (2Q24), totaling 34.4 million units, according to preliminary data from the International Data Corporation (IDC) Worldwide Quarterly Personal Computing Device Tracker.
Kioxia Announces Completion of New Flash Memory Manufacturing Building in Kitakami Plant
Kioxia Corporation today announced that the building construction of Fab2 (K2) of its Kitakami Plant was completed in July.
Lam Research Introduces Lam Cryo 3.0 Cryogenic Etch Technology
Production-proven innovation addresses critical manufacturing challenges as memory makers target 1,000-layer 3D NAND by decade end.
JEDEC’s JC-15 Committee Invites Industry Participation for Advancing Thermal Characterization Standards for Semiconductor Packages
JEDEC Solid State Technology Association today announced that its JC-15 Committee for Thermal Characterization Techniques for Semiconductor Packages welcomes interested companies to join JEDEC and participate in committee meetings and activities.
