IC Insights will release its new 2020 McClean Report—A Complete Analysis and Forecast of the Integrated Circuit Industry next month. A portion of the new report will examine the top-50 semiconductor sales leaders, the top-50 fabless IC companies, and the major semiconductor foundries in 2020.
Packaging
Semiconductor Industry Applauds NDAA Enactment, Urges Full Funding for Semiconductor Manufacturing and Research Provisions
The Semiconductor Industry Association (SIA) today applauded Congress for enacting the National Defense Authorization Act (NDAA), legislation that includes Title XCIX, “Creating Helpful Incentives to Produce Semiconductors for America,” which authorizes federal incentives to promote semiconductor manufacturing and federal investments in semiconductor research.
Teledyne to Acquire FLIR Systems
Teledyne Technologies Incorporated and FLIR Systems, Inc. jointly announced today that they have entered into a definitive agreement under which Teledyne will acquire FLIR in a cash and stock transaction valued at approximately $8.0 billion.
What to Expect from the IC Industry in 2021
The year 2020 was a most unusual and challenging year for businesses and consumers.
Electronics and Photonics Innovation Center (EPIC) Purchases Palomar 3880 Die Bonder for Expanded Packaging Research
Palomar Technologies announced today that Electronics and Photonics Innovation Center (EPIC) has purchased a fully loaded 3880 Die Bonder.
Secure-IC Announces the Availability of its Protection Technologies in the Cloud
Secure-IC announces today the availability of its protection technologies (“Silicon Intellectual Property” – IPs) in the Cloud.
Semtech and AWS Collaborate on AWS IoT Core for LoRaWAN
Semtech Corporation announced that they have teamed up with Amazon Web Services (AWS) to integrate the LoRaWAN protocol on the Network Server with AWS IoT Core, AWS’s managed Cloud service that lets connected devices easily and securely interact with Cloud applications and other devices.
IAR Systems Enables Linux-Based Continuous Integration and Automated Workflows for RISC-V
IAR Systems, the future-proof supplier of software tools and services for embedded development, releases an update of its RISC-V build tools supporting implementation in Linux-based frameworks for automated application build and test processes.
Onto Innovation Announces First Customer Qualification of New Aspect IRCD System
Onto Innovation Inc. today announced the first customer acceptance and purchase of its new product, the Aspect System, at one of the top three memory manufacturers of leading-edge 3D-NAND devices.
CEA-Leti Scientists Present In-Memory Computing Pathways for Edge-AI & Neural Networks with 3D Architectures & Resistive-RAM
CEA-Leti presented two papers this week at IEDM 2020 that confirm the advantages of combining 3D architectures and resistive-random-access-memories (RRAM) for in-memory computing (IMC), and their applications for Edge-AI and neural networks.
