Packaging

GLOBALFOUNDRIES Collaborates with Cadence on Availability of Mixed-Signal OpenAccess PDK for 22FDX Platform to Enable Advanced Mixed-Signal and mmWave Design

Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced a collaboration with GLOBALFOUNDRIES (GF) that resulted in the availability of a Mixed-Signal OpenAccess process design kit (PDK) that supports GF’s 22FDX platform.

Xilinx and Continental Collaborate to Create Auto Industry’s First Production-Ready 4D Imaging Radar for Autonomous Driving

Xilinx, Inc. and Continental today announced that Xilinx will power Continental’s new Advanced Radar Sensor (ARS) 540 with the Zynq UltraScale+ MPSoC platform, creating the automotive industry’s first production-ready 4D imaging radar.

KLA Announces Enhanced Portfolio of Systems for Advanced Packaging

KLA Corporation announced the launch of the Kronos 1190 wafer-level packaging inspection system, the ICOS F160XP die sorting and inspection system and the next generation of the ICOS T3/T7 Series of packaged integrated circuit (IC) component inspection and metrology systems.

Scintil Photonics Appoints Soitec as Board Observer

Scintil Photonics, a developer of silicon photonic fully integrated circuits including laser integration, today announces the appointment of Ionut Radu, director of R&D at Soitec, as an observer on Scintil’s board of directors.

SEMI-NBMC Invites White Paper Proposals for Funding of Human Monitoring Innovations

SEMI Nano-Bio Materials Consortium (NBMC) today released a Request for Proposals (RFP) for innovations in ambulatory monitoring, wearable technologies for cognitive assessment, and innovative power sources for wearable monitors.

Like-Minded Nations Can Advance Their Leadership in Semiconductors Through International Collaboration, Says New ITIF Report

The semiconductor sector constitutes one of today’s most important industries, providing the core technology that powers the modern digital world. Yet countries seeking self-sufficiency in this space threaten their own competitiveness, as succeeding entirely independently is almost impossible in such a complex sector, argues a new report released today by the Information Technology and Innovation Foundation.

SEMICON Taiwan 2020 Hybrid Opens Tomorrow With Advanced, Smart and Green Manufacturing in Spotlight

SEMICON Taiwan 2020 Hybrid opens tomorrow with advanced, smart and green manufacturing in the spotlight on-site and online as industry visionaries and experts gather for the latest market trends, business opportunities and innovations across the semiconductor supply chain.

Semiconductor Materials Market to Hit $50B in 2020 Up 3%

TECHCET announces that 2020 global materials revenues in semiconductor fabrication are now forecasted upward year-over-year (YoY) despite potential disruptions to manufacturing

Sensing and Computing for ADAS Vehicles: Forecasts and Expectations

ADAS sensor market will reach more than $22B in 2025 with radar and camera leading the market.

Study Finds Federal Incentives for Domestic Semiconductor Manufacturing Would Strengthen America’s Chip Production, Economy, National Security, Supply Chains

The Semiconductor Industry Association (SIA), in partnership with the Boston Consulting Group (BCG), today released a study analyzing the impact of proposed federal incentives for domestic semiconductor manufacturing.

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