Packaging

New Materials for Extra Thin Computer Chips

For a long time, something important has been neglected in electronics: If you want to make electronic components smaller and smaller, you also need the right insulator materials.

ESD Alliance Reports Electronic Design Automation Industry Revenue Growth for Q1 2020

The Electronic System Design (ESD) Alliance Market Statistics Service (MSS) today announced that the Electronic Design Automation (EDA) industry revenue increased 3.5 percent in Q1 2020 to $2,698 million, compared to $2,606.4 million in Q1 2019. The four-quarter moving average, which compares the most recent four quarters to the prior four quarters, increased by 5.2 percent.

Traditional PC Shipments Continue to Grow Amid Global Economic Slowdown, According to IDC

The second quarter of 2020 (2Q20) ended well for the Traditional PC market, comprised of desktops, notebooks, and workstations, with global shipments growing 11.2% year over year reaching a total of 72.3 million units.

Renesas Unveils Integrated LIN Interface Sensor Signal Conditioner for Electric and Hybrid Electric Vehicle HVAC Systems

Renesas Electronics Corporation (TSE:6723), a supplier of advanced semiconductor solutions, today introduced the ZSSC4132 – an automotive pressure sensor solution featuring an integrated certified LIN v2.2a interface.

CyberOptics Unveils WX3000 Metrology and Inspection System for Semiconductor Wafer-Level and Advanced Packaging at Virtual SEMICON West

CyberOptics Corporation (NASDAQ: CYBE), a leading global developer and manufacturer of high-precision 3D sensing technology solutions, will unveil the new Multi-Reflection Suppression (MRS)-enabled 3D and 2D WX3000 Metrology and Inspection systems for wafer-level and advanced packaging applications at the virtual SEMICON West show, July 20-23rd.

Mitsubishi Electric Develops Accurate Circuit Simulation Technology for SiC-MOSFETs

Mitsubishi Electric Corporation (TOKYO:6503) announced today that it has developed a highly accurate Simulation Program with Integrated Circuit Emphasis (SPICE) model to analyze the electronic circuitry of discrete power semiconductors.

Imec and GLOBALFOUNDRIES Announce Breakthrough in AI Chip, Bringing Deep Neural Network Calculations to IoT Edge Devices

Imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, and GLOBALFOUNDRIES (GF), the world’s leading specialty foundry, today announced a hardware demonstration of a new artificial intelligence chip.

SST Vacuum Reflow Systems Offers Trade-In on DAP Series Furnaces

Palomar Technologies, a global leader in total process solutions for advanced photonics and microelectronic device packaging today, announced that SST Vacuum Reflow Systems, a wholly-owned subsidiary of Palomar Technologies, is offering a 25% discount off the retail price of the SST 3130 programmable vacuum reflow oven with the trade-in of an SST DAP series furnace.

Virtual SEMICON West 2020 to Gather Industry Leaders, Visionaries to Highlight Opportunities for Stronger Preparedness for Global Challenges

Better readiness for future global shocks through technology innovation will come into sharp focus at the Virtual SEMICON West 2020, July 20-23, as more than 150 semiconductor industry visionaries and government leaders gather for keynotes, fireside chats and executive panels on opportunities for improving responses to worldwide challenges.

130 years of Pfeiffer Vacuum

Pfeiffer Vacuum has been setting standards in vacuum technology for 130 years. Science and industry have benefited equally from the numerous innovations developed and successfully brought to the market by this long-established company.

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